EP1K50TI144-1X vs EP1K30TI144-2N Comparación
Comparación detallada lado a lado de EP1K50TI144-1X por Intel y EP1K30TI144-2N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1K50TI144-1X | EP1K30TI144-2N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $10,95 | $25,00 |
| Family | ACEX 1K | — |
| Series | EP1K50 | ACEX-1K |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Equivalent Gates | 50,000 | — |
| Logic Elements / Cells | 2,880 | 1728 |
| Configurable Logic Blocks (CLBs) | 360 | — |
| Maximum User I/O Pins | 102 | — |
| Dedicated Input Pins | 6 | — |
| Number of Terminals | 144 | — |
| Package Code | QFP / TQFP-144 (Industrial) | — |
| Package Style | Low-profile Fine-pitch Quad Flat Pack (LFQFP / LQFP), 0.5 mm pitch | — |
| Terminal Form | Gull Wing | — |
| Supply Voltage (VCCINT) | 2.375 V to 2.625 V (nominal 2.5 V) | — |
| Frecuencia de reloj máxima | 90 MHz | — |
| Temperatura de funcionamiento | -40 C to +85 C (Industrial) | — |
| Configuration Method | Volatile SRAM, external configuration device required | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant (per Utmel product note) |
| Speed Grade | -1 (slowest, lowest cost) | -2 |
| Design Toolchain | Quartus II (legacy support) | — |
| Manufacturer | — | Intel (formerly Altera) |
| Typical Gate Count | — | 30,000 gates |
| Embedded Memory (RAM bits) | — | 24,576 bits |
| Maximum User I/O | — | 102 |
| Number of Logic Array Blocks (LABs) | — | [DATA_NEEDED: LAB count] |
| Number of Embedded Array Blocks (EABs) | — | [DATA_NEEDED: EAB count] |
| Core Voltage (VCCINT) | — | 2.5 V |
| I/O Voltage (VCCIO) | — | 2.5 V / 3.3 V |
| Process Technology | — | 0.22 µm CMOS SRAM |
| Operating Temperature Grade | — | Industrial |
| Rango de temperatura de funcionamiento | — | -40 °C to +100 °C ambient |
| Encapsulado | — | 144-pin LQFP |
| Lead Pitch | — | 0.5 mm |
| Configuration Interface | — | JTAG (IEEE 1149.1), serial passive/active |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |