EP1K50TI144-1X vs EP1K30TI144-2N Comparaison
Comparaison détaillée côte à côte de EP1K50TI144-1X par Intel et EP1K30TI144-2N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP1K50TI144-1X | EP1K30TI144-2N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $10,95 | $25,00 |
| Family | ACEX 1K | — |
| Series | EP1K50 | ACEX-1K |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Equivalent Gates | 50,000 | — |
| Logic Elements / Cells | 2,880 | 1728 |
| Configurable Logic Blocks (CLBs) | 360 | — |
| Maximum User I/O Pins | 102 | — |
| Dedicated Input Pins | 6 | — |
| Number of Terminals | 144 | — |
| Package Code | QFP / TQFP-144 (Industrial) | — |
| Package Style | Low-profile Fine-pitch Quad Flat Pack (LFQFP / LQFP), 0.5 mm pitch | — |
| Terminal Form | Gull Wing | — |
| Supply Voltage (VCCINT) | 2.375 V to 2.625 V (nominal 2.5 V) | — |
| Fréquence d'horloge maximale | 90 MHz | — |
| Température de fonctionnement | -40 C to +85 C (Industrial) | — |
| Configuration Method | Volatile SRAM, external configuration device required | — |
| Type de montage | Surface Mount | Surface Mount |
| Statut RoHS | [DATA_NEEDED: RoHS status] | Compliant (per Utmel product note) |
| Speed Grade | -1 (slowest, lowest cost) | -2 |
| Design Toolchain | Quartus II (legacy support) | — |
| Manufacturer | — | Intel (formerly Altera) |
| Typical Gate Count | — | 30,000 gates |
| Embedded Memory (RAM bits) | — | 24,576 bits |
| Maximum User I/O | — | 102 |
| Number of Logic Array Blocks (LABs) | — | [DATA_NEEDED: LAB count] |
| Number of Embedded Array Blocks (EABs) | — | [DATA_NEEDED: EAB count] |
| Core Voltage (VCCINT) | — | 2.5 V |
| I/O Voltage (VCCIO) | — | 2.5 V / 3.3 V |
| Process Technology | — | 0.22 µm CMOS SRAM |
| Operating Temperature Grade | — | Industrial |
| Plage de température de fonctionnement | — | -40 °C to +100 °C ambient |
| Boîtier | — | 144-pin LQFP |
| Lead Pitch | — | 0.5 mm |
| Configuration Interface | — | JTAG (IEEE 1149.1), serial passive/active |
| Niveau MSL | — | [DATA_NEEDED: MSL rating] |