EP1M350F780C6 vs EP1M350F780C7ES Comparación

Comparación detallada lado a lado de EP1M350F780C6 por Intel y EP1M350F780C7ES por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Intel
EP1M350F780C7ES EP1M350F780C7ES - 486-I/O Mercury FPGA | Intel

EP1M350F780C7ES - 486-I/O Mercury FPGA | Intel

EP1M350F780C7ES ✓ Activo

Comparación de especificaciones

Parámetro EP1M350F780C6 EP1M350F780C7ES
Marca Intel Intel
Categoría FPGA & CPLD FPGA & CPLD
Estado del ciclo de vida NRND Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $905,00 $0,00
Manufacturer Intel (formerly Altera) —
Series Mercury FPGA —
Logic Family CMOS CMOS
Number of User I/Os 486 —
Total Pins / Balls 780 —
Encapsulado 780-FBGA (FineLine BGA), 29 mm x 29 mm —
Tipo de montaje Surface Mount Surface Mount
Core Supply Voltage 1.8 V (1.71 V to 1.89 V) —
Temperatura de funcionamiento 0 C to 85 C (TJ, commercial grade) 0 C to 85 C
Integrated Transceivers Yes, up to 1.25 Gbps with CDR support —
Logic Elements / LUTs [DATA_NEEDED: logic element count] —
On-chip Memory [DATA_NEEDED: embedded memory size] —
Estado RoHS Non-compliant (per one distributor listing) unknown
Lead Free Status [DATA_NEEDED: lead-free status] —
Package Style Bulk tray per distributor listings —
Device Type FPGA (Field Programmable Gate Array) —
Programmable Logic Type In-system programmable —
Product Type — Field Programmable Gate Array (FPGA)
User I/O Count — 486 pins
Total Package Pins — 780 pins
Package Type — FINE LINE BGA-780
Package Category — 780-BBGA
Tensión de alimentación — 1.8 V
Maximum Stated Transceiver Data Rate — 1.25 Gbps
Channels Supported at 1.25 Gbps — 8 channels
Remaining Channel Limit — 10 channels at 1.0 Gbps or less
Clock Data Recovery — Supported
High-Speed Transceivers — Integrated
REACH Status — unknown
Logic Element Count — [DATA_NEEDED: logic element count]
Embedded Memory Capacity — [DATA_NEEDED: embedded memory capacity]
Transceiver Count — [DATA_NEEDED: transceiver count]
Package Dimensions — [DATA_NEEDED: package dimensions]
Resistencia térmica — [DATA_NEEDED: junction-to-ambient thermal resistance]

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