EP1SGX25DF1020I6N vs EP1SGX25DF1020I7N Comparación

Comparación detallada lado a lado de EP1SGX25DF1020I6N por Intel y EP1SGX25DF1020I7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Comparación de especificaciones

Parámetro EP1SGX25DF1020I6N EP1SGX25DF1020I7N
Marca Intel Intel
Categoría FPGA & CPLD FPGA & CPLD
Estado del ciclo de vida Obsolete Obsolete
Estado del stock In Stock In Stock
Precio unitario (USD) $165,00 $0,00
Family Stratix GX Stratix GX
Series EP1SGX25 EP1SGX25
Logic Elements 25,660 25,660
Configurable Logic Blocks (CLBs) 2,566 2,566
User I/Os 607 —
Maximum Operating Frequency [DATA_NEEDED: max internal clock frequency in MHz] 4385.97 MHz
Process Technology 130 nm CMOS 130 nm
Core Supply Voltage 1.425 V to 1.575 V (1.5 V nominal) —
Multi-Gigabit Transceivers Integrated (up to 3.125 Gbps per channel) —
Encapsulado 1020-ball FC-FBGA, 33 mm × 33 mm, 1.0 mm pitch —
Tipo de montaje Surface Mount (BGA) Surface Mount
Lead Finish Lead Free —
Temperatura de funcionamiento 0 °C to +85 °C (industrial) —
Nivel MSL [DATA_NEEDED: moisture sensitivity level] —
Estado RoHS Compliant —
Memory Embedded TriMatrix memory blocks —
DSP Blocks Integrated DSP blocks for fixed/floating-point arithmetic —
Clock Management PLLs with dynamic phase alignment (DPA) —
Grade Identifier I6 (industrial, speed grade 6) —
Manufacturer Intel (formerly Altera) —
Core Voltage — 1.5 V
Number of Pins / Balls — 1020
Package Type — FC-FBGA
Package Code — BGA
Package Shape — Square
Terminal Form — Ball
Temperature Grade — Military (-40C to +100C)
Device Type — Field Programmable Gate Array (FPGA)
Configuration Cell — SRAM-based (external configuration device required)

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