EP1SGX25DF672C6N vs EP1SGX25DF672I5N Comparación
Comparación detallada lado a lado de EP1SGX25DF672C6N por Intel y EP1SGX25DF672I5N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP1SGX25DF672C6N - Stratix GX FPGA, 25K LE, 672-FBGA | Intel (Altera)
EP1SGX25DF672C6N ObsoleteIntel
EP1SGX25DF672I5N - Stratix GX FPGA, 25.6K LE, 3.1875Gbps SERDES
EP1SGX25DF672I5N ⚠ Última compraComparación de especificaciones
| Parámetro | EP1SGX25DF672C6N | EP1SGX25DF672I5N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $210,00 | $118,00 |
| Series | Stratix GX | — |
| Family | Stratix GX (Stratix I GX) | Stratix GX |
| Logic Elements / Cells | 25,660 | — |
| Logic Array Blocks (LABs) | 2,566 | — |
| User I/O Count | 455 | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Process Technology | 130 nm CMOS | 130 nm CMOS |
| Logic Family | CMOS | CMOS (SRAM-based FPGA) |
| Encapsulado | FBGA-672 (FC-FBGA), 33 x 33 mm, 1.0 mm pitch | 672-ball FC-FBGA |
| Temperatura de funcionamiento | 0C to 85C (commercial) | -40C to +85C (Industrial) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | 3 (168 hours) | — |
| HTSUS Code | 8542.39.0001 | — |
| Estado RoHS | Lead Free (per part suffix 'N' designator) | Compliant |
| Recuento de pines | 672 | — |
| Logic Elements | — | 25,660 |
| Logic Cells (CLBs) | — | 2,566 |
| High-Speed Transceiver Channels | — | 4 to 20 (CDR/SERDES) |
| Max Transceiver Data Rate | — | 3.1875 Gbps |
| Package Body Size | — | 33 x 33 mm |
| Ball Pitch | — | 1.0 mm |
| Lead-Free | — | Yes |
| Total I/O Pins | — | [DATA_NEEDED: total user I/O pin count] |
| Embedded Memory | — | [DATA_NEEDED: TriMatrix memory block count] |