EP20K100CF324C7 vs EP20K100CF324C8 Comparación
Comparación detallada lado a lado de EP20K100CF324C7 por Intel y EP20K100CF324C8 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP20K100CF324C7 | EP20K100CF324C8 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $27,80 | $50,00 |
| Family | FLEX 10K | APEX-20K |
| Series | EP20K100 | — |
| Logic Elements (LEs) | 4,160 | — |
| System Gates | 100,000 | — |
| Embedded Array Blocks (EABs) | 12 | — |
| Maximum RAM Bits | 49,152 | — |
| Maximum User I/O | 246 | 246 |
| Encapsulado | 324-FBGA (FineLine BGA) | 324-FBGA (FineLine BGA) |
| Supply Voltage - Core | 1.8 V | — |
| Supply Voltage - I/O | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Temperatura de funcionamiento | 0 °C to +70 °C (commercial) | 0°C to +85°C (commercial) |
| Speed Grade | C7 (slowest commercial bin) | C8 (commercial, 8 ns) |
| Process Technology | 0.22 µm CMOS SRAM | 0.18 µm CMOS |
| Configuration Method | Serial PROM (EPC2/EPC4/EPC8) or JTAG | — |
| Tipo de montaje | Surface Mount (BGA) | — |
| Estado RoHS | unknown | [DATA_NEEDED: RoHS status] |
| Logic Elements | — | 4,160 |
| Typical Gates | — | 100,000 |
| Embedded RAM Bits | — | 53,248 |
| Embedded System Blocks (ESBs) | — | 26 |
| Ball Pitch | — | 1.0 mm |
| Core Voltage | — | 1.8 V typical |
| Configuration Interface | — | JTAG (IEEE 1149.1), serial/parallel |
| I/O Standards | — | LVCMOS, LVTTL, SSTL, HSTL |
| Design Software | — | Quartus II (legacy) |