EP20K100EFC324-2X vs EP20K100FC324-1V Comparación
Comparación detallada lado a lado de EP20K100EFC324-2X por Intel y EP20K100FC324-1V por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP20K100EFC324-2X | EP20K100FC324-1V |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $99,50 | $118,40 |
| Family | APEX 20KE | — |
| Device Type | SPLD / FPGA (Field Programmable Gate Array) | — |
| System Gates | 100,000 gates | — |
| Logic Elements / Cells | 4,160 | — |
| Total RAM Bits | 53,248 bits | 53248 |
| LABs / CLBs | 416 | — |
| Maximum User I/Os | 246 | — |
| Number of I/O Banks | 8 (per APEX 20KE family) | — |
| Propagation Delay | 1.6 ns | — |
| Internal Operating Frequency | Up to 250 MHz | — |
| Core Supply Voltage (VCCINT) | 1.8 V | — |
| I/O Supply Voltage (VCCIO) | MultiVolt: 1.8 V / 2.5 V / 3.3 V | — |
| Process Technology | 0.22 µm CMOS (all-layer copper metal) | — |
| Speed Grade | -2X | -1V (commercial) |
| Encapsulado | 324-ball FBGA (FineLine BGA), 19x19 mm, 1.27 mm pitch | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | 0 °C to 85 °C (Commercial) | 0C to +85C (commercial) |
| Programming Interface | IEEE 1149.1 JTAG | JTAG (IEEE 1149.1) / in-system |
| Configuration Modes | Passive Serial, Passive Parallel, JTAG, Altera configuration EPROM | — |
| Estado RoHS | [DATA_NEEDED: confirm against lot-specific documentation] | [DATA_NEEDED: RoHS compliance] |
| Series | — | APEX-20K® |
| Number of Logic Elements / Cells | — | 4160 |
| Number of Gates (typical) | — | 100000 |
| Number of I/O | — | 252 |
| Number of LABs/CLBs | — | [DATA_NEEDED: number of Logic Array Blocks] |
| Number of EABs | — | [DATA_NEEDED: number of Embedded Array Blocks] |
| Supply Voltage - Core (VCCINT) | — | 2.375 V to 2.625 V |
| Supply Voltage - I/O (VCCIO) | — | 3.0 V / 3.3 V / 5.0 V tolerant (per I/O standard) |
| Encapsulado / Carcasa | — | 324-FBGA (FineLine BGA, 19x19 mm) |
| Supplier Device Package | — | 324-FBGA |
| Number of PLLs | — | 4 |
| I/O Standards Supported | — | LVCMOS, LVTTL, PCI, SSTL, GTL+, HSTL |
| Architecture | — | MultiCore (LUT + product-term + embedded memory) |