EP20K100EFC324-2X - APEX 20KE 100K Gates FPGA | Intel / Altera
N.º de pieza: EP20K100EFC324-2X ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $162 | $1.620,00 |
| 100 | $138 | $13.800,00 |
| 500 | $118 | $59.000,00 |
| 1.000 | $99.5 | $99.500,00 |
EP20K100EFC324-2X Descripción general
An FPGA (Field Programmable Gate Array) is a type of Programmable Logic Device (PLD) that combines a large array of configurable logic blocks (LABs/CLBs), embedded memory blocks, I/O elements, and programmable interconnect into a single semiconductor IC. FPGAs occupy the high-density end of the programmable-logic hierarchy (above CPLDs and SPLDs) and are widely used for parallel DSP, custom glue logic, bus interfacing, and prototype ASIC replacement. The APEX 20KE family, in particular, pioneered multi-core architecture (MegaLAB) that combines lookup tables, product-term logic and Embedded Array Blocks (EABs) on a single die.
Key features of the EP20K100EFC324-2X include: 100K system gates, 4,160 logic cells, 53248 bits of embedded RAM, 416 LABs/CLBs, 246 maximum user I/Os, 1.8 V core supply, in-system programmability via IEEE 1149.1 JTAG, MultiVolt I/O support for interfacing to 1.8 V / 2.5 V / 3.3 V logic, and a 4-input Look-Up Table (LUT)-based fine-grain architecture. The -2X speed grade delivers approximately 35% faster design performance than the original APEX 20K family, according to Altera's published device-family literature.
The device uses a fine-grain, LUT-based architecture organized into MegaLAB structures that contain 16 Logic Array Blocks (LABs), an Embedded System Block (ESB) of 2 Kbits, and dedicated carry chains for fast arithmetic. Distributed and block RAM combined with dedicated clock networks and PLL-style clock-management blocks (per Altera APEX 20KE family documentation) simplify high-speed digital design. Configuration is stored in SRAM cells and is loaded via JTAG, passive serial, passive parallel, or Altera configuration EPROMs.
Typical applications include telecommunications line-card glue logic, industrial control and factory-automation controllers, ASIC prototyping, DSP coprocessing front-ends, custom bus-bridges, and PCI interface bridging. Its 246 user I/Os make it well-suited to legacy parallel-bus and memory-interface designs that predate modern System-on-Chip integration.
A key design consideration with the EP20K100EFC324-2X is that the APEX 20KE family has been NRND (Not Recommended for New Designs) by Intel / Altera for many years, so engineers should plan a migration path to a Cyclone, MAX, or Stratix equivalent for new production. The FBGA-324 (19x19 mm) package requires careful PCB layout with microvia or via-in-pad technology to route signals out of the inner balls.
This page synthesizes distributor pricing, drop-in same-family alternatives, FBGA-324 footprint compatibility notes, and practical APEX 20KE design migration guidance not aggregated on any single distributor listing.
Alternativas directas para EP20K100EFC324-2X — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP20K100EFC324-2X (mismo factor de forma y huella) — difiere en Family, Process Technology, Package, Operating Temperature, Series.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP20K100EFC324-2
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EP20K200EFC324-2X
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EP20K100EFC324-1N
✅ Sustitución directa✓ En stock
$108 / unidad
Ver hoja de datos →EP20K100EFC324-2X Valores máximos y características eléctricas
| Family | APEX 20KE |
| Device Type | SPLD / FPGA (Field Programmable Gate Array) |
| System Gates | 100,000 gates |
| Logic Elements / Cells | 4,160 |
| Total RAM Bits | 53,248 bits |
| LABs / CLBs | 416 |
| Maximum User I/Os | 246 |
| Number of I/O Banks | 8 (per APEX 20KE family) |
| Propagation Delay | 1.6 ns |
| Internal Operating Frequency | Up to 250 MHz |
| Core Supply Voltage (VCCINT) | 1.8 V |
| I/O Supply Voltage (VCCIO) | MultiVolt: 1.8 V / 2.5 V / 3.3 V |
| Process Technology | 0.22 µm CMOS (all-layer copper metal) |
| Speed Grade | -2X |
| Encapsulado | 324-ball FBGA (FineLine BGA), 19x19 mm, 1.27 mm pitch |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | 0 °C to 85 °C (Commercial) |
| Programming Interface | IEEE 1149.1 JTAG |
| Configuration Modes | Passive Serial, Passive Parallel, JTAG, Altera configuration EPROM |
Guía de configuración de pines de EP20K100EFC324-2X 324-ball fbga (fineline bga), 19x19 mm, 1.27 mm pitch
Configuración de pines para EP20K100EFC324-2X (encapsulado 324-ball fbga (fineline bga), 19x19 mm, 1.27 mm pitch). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP20K100EFC324-2X.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP20K100EFC324-2X es adecuado para 6 aplicacións: Telecommunications Line-Card Glue Logic, Industrial Control and Factory Automation Controllers, ASIC Prototyping and Validation, Custom Bus Bridges and Protocol Converters, DSP Coprocessor Front-End, Legacy PCI Interface Card Designs.
Telecommunications Line-Card Glue Logic
The EP20K100EFC324-2X fits telecom line-card glue logic because its 100K system gates, 4,160 logic cells and 246 user I/Os are enough to bridge legacy TDM buses, framing devices and network processors without a co-processor. The MultiVolt I/O (1.8/2.5/3.3 V on VCCIO banks) lets the device talk directly to 3.3 V PHY chips while running its core at 1.8 V, which simplifies mixed-voltage board design. The 53,248 bits of embedded RAM serve as fast lookup-table and packet-header storage for backplane routing. Compared with an ASIC redesign cycle of 12-18 months, this FPGA can be programmed in days via JTAG, accelerating NPI for last-mile DSLAM and SONET line cards.
Recomendado
Industrial Control and Factory Automation Controllers
For industrial PLC and motion-control cards, the EP20K100EFC324-2X delivers deterministic logic through its 4-input LUT-based fabric and dedicated carry chains, which give predictable timing for encoder quadrature decoding and PWM generation. The 246 I/Os support a large number of 24 V opto-isolated digital inputs and relay-driver outputs in parallel, eliminating the need for external mux expanders. Operating from a 1.8 V core, the device dissipates roughly 0.5-1 W in typical gate-utilization designs, which simplifies thermal design inside sealed IP65 enclosures. Existing field installations can keep running on this part while new designs move to MAX 10 or Cyclone IV E for active lifecycle support.
Recomendado
ASIC Prototyping and Validation
The EP20K100EFC324-2X is widely used as an ASIC prototype vehicle because its 100K gates and 246 I/Os are large enough to map an entire mid-complexity ASIC RTL netlist. Engineers partition the design across multiple APEX 20KE devices and use JTAG-based multi-device configuration chains to validate the ASIC's real-world I/O behaviour, timing margins and bus protocols before committing to mask tooling. The 53,248-bit embedded RAM also helps emulate SRAM blocks and FIFO buffers that the final ASIC will integrate. Quartus II synthesis flow matches typical ASIC synthesis, so timing closure on the FPGA is a good predictor of post-layout ASIC timing.
Recomendado
Custom Bus Bridges and Protocol Converters
When a designer needs to bridge PCI, VME, ISA or proprietary backplane buses to a modern processor, the EP20K100EFC324-2X's 246 user I/Os and MultiVolt I/O make it an ideal bus-translation engine. The 4,160 logic cells can implement master/target state machines for both buses simultaneously, while the 53,248-bit embedded RAM acts as a shared mailbox and FIFO buffer between the two domains. Bus-bridge designs that need more logic capacity can drop in the EP20K200EFC324-2X on the same FBGA-324 footprint. This keeps the PCB layout fixed while doubling the available logic resources for higher-throughput bridge designs.
Recomendado
DSP Coprocessor Front-End
The EP20K100EFC324-2X serves as a DSP front-end that pre-processes data streams before handing them to a host DSP or microprocessor. Its 4,160 logic cells and fast carry chains perform FIR filters, FFT butterflies and CORDIC rotations at rates that complement a software DSP running control loops. The 53,248-bit embedded RAM holds twiddle-factor tables and sample buffers, eliminating external memory fetches on each clock cycle. The 246 I/Os simultaneously connect to multiple ADC/DAC channels and the host processor's external memory interface, making this FPGA a cost-effective co-processor for mid-rate signal-processing designs.
Recomendado
Legacy PCI Interface Card Designs
The EP20K100EFC324-2X is a natural fit for legacy 32-bit/33 MHz PCI interface cards because its 246 user I/Os and MultiVolt 3.3 V I/O banks can talk directly to a PCI bus without external transceivers. The 4,160 logic cells hold the PCI target/master state machine, configuration-space registers and interrupt logic in a single device, while the 53,248-bit embedded RAM provides DMA descriptor rings and small payload buffers. Although PCI has been superseded by PCIe in new designs, thousands of industrial, instrumentation and test cards still ship with this FPGA because of its deterministic 33 MHz timing and proven Quartus II IP library.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP20K100EFC324-2X — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP20K100EFC324-2 | EP20K200EFC324-2X | EP20K100EFC324-1N |
|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 324-ball FBGA (19x19 mm) | 324-ball FBGA (19x19 mm) - same | 324-ball FBGA (19x19 mm) - same | 324-ball FBGA (19x19 mm) - same |
| System Gates | 100K | 100K | 200K | 100K |
| Logic Cells / Elements | 4,160 | 4,160 | 8,320 | 4,160 |
| Maximum User I/Os | 246 | 246 | 246 | 246 |
| Embedded RAM Bits | 53,248 | 53,248 | 106,496 | 53,248 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Speed Grade | -2X (fastest) | -2 (slower) | -2X | -1N (industrial temp) |
| Lifecycle Status | NRND | NRND | NRND | NRND |
Diferenciadores clave
- Highest speed grade in the APEX 20KE 100K-gate family (frente a EP20K100EFC324-2)
- Highest logic density in the same FBGA-324 footprint (frente a EP20K100EFC324-1N)
- Lower-density, lower-cost option on the same FBGA-324 footprint (frente a EP20K200EFC324-2X)
Notas de diseño
The APEX 20KE family uses 1.8 V VCCINT but its I/O banks support 1.8 V / 2.5 V / 3.3 V on VCCIO - mixing the wrong bank voltage is a common bring-up failure. Always check the Quartus II 'Device and Pin Options' report to confirm VCCIO bank assignments before powering the board, and verify that no pin is configured for an I/O standard whose voltage is not present on that bank. Estimated power dissipation for a 50% utilization, 250 MHz design is roughly 0.8 W from VCCINT and another 0.1-0.3 W from VCCIO, depending on toggle rate.
The 324-ball FBGA package has a junction-to-ambient thermal resistance (θJA) in the 25-35 °C/W range when mounted on a JEDEC 4-layer test board with adequate thermal vias. For continuous operation near 250 MHz with high toggle rates, place a thermal-via array directly under the package center pad and stitch copper pours on inner layers. Estimated: at 1.0 W total dissipation and 30 °C/W θJA, junction temperature rises 30 °C above ambient, so an 85 °C commercial-grade device hits its junction limit at 55 °C ambient without thermal management.
Route the 324-ball FBGA (1.27 mm pitch, 19x19 mm body) on a PCB stack-up that supports microvias or via-in-pad to escape inner balls. Use 0.10 mm (4 mil) trace width with 0.10 mm spacing on the top layer for escape routing, and place a 6x6 thermal-via array under the central ground balls. Keep all VCCINT and VCCIO decoupling capacitors within 5 mm of their respective balls, with a 0.1 µF / 1 µF / 10 µF value stack to cover high-frequency and bulk current transients.
Información de cumplimiento
RoHS, REACH, lead-free and halogen-free status for the EP20K100EFC324-2X were not in the provided verified web data; confirm with the lot-specific manufacturer documentation before shipping into regulated markets. AEC-Q100 does not apply because this is a commercial-grade FPGA, not an automotive-qualified part.
