EP20K100EFC324-2X vs EP20K30EFC324-2X Comparación
Comparación detallada lado a lado de EP20K100EFC324-2X por Intel y EP20K30EFC324-2X por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP20K100EFC324-2X | EP20K30EFC324-2X |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $99,50 | $21,00 |
| Family | APEX 20KE | APEX-20KE (1.8V, LVDS) |
| Device Type | SPLD / FPGA (Field Programmable Gate Array) | FPGA (Field Programmable Gate Array) |
| System Gates | 100,000 gates | — |
| Logic Elements / Cells | 4,160 | — |
| Total RAM Bits | 53,248 bits | 24,576 |
| LABs / CLBs | 416 | — |
| Maximum User I/Os | 246 | — |
| Number of I/O Banks | 8 (per APEX 20KE family) | — |
| Propagation Delay | 1.6 ns | — |
| Internal Operating Frequency | Up to 250 MHz | — |
| Core Supply Voltage (VCCINT) | 1.8 V | — |
| I/O Supply Voltage (VCCIO) | MultiVolt: 1.8 V / 2.5 V / 3.3 V | — |
| Process Technology | 0.22 µm CMOS (all-layer copper metal) | 0.22 micrometer |
| Speed Grade | -2X | -2X |
| Encapsulado | 324-ball FBGA (FineLine BGA), 19x19 mm, 1.27 mm pitch | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | 0 °C to 85 °C (Commercial) | 0C to 85C [DATA_NEEDED: full industrial range] |
| Programming Interface | IEEE 1149.1 JTAG | — |
| Configuration Modes | Passive Serial, Passive Parallel, JTAG, Altera configuration EPROM | — |
| Estado RoHS | [DATA_NEEDED: confirm against lot-specific documentation] | — |
| Series | — | APEX-20KE |
| Manufacturer | — | Altera (Intel) |
| Typical Gates | — | 30,000 |
| Logic Elements | — | 1,200 |
| Maximum User I/O | — | 128 |
| Pin-to-Pin Delay | — | 2.69 ns |
| Core Supply Voltage | — | 1.71 V to 1.89 V (1.8 V nominal) |
| Encapsulado / Carcasa | — | 324-BGA (FineLine) |
| Supplier Device Package | — | 324-FBGA (19x19 mm) |
| I/O Standard Support | — | LVDS, LVTTL, LVCMOS, PCI |
| PLL Count | — | 4 |
| Configuration Method | — | Serial / Parallel PROM or flash |