EP20K100FC324-3 vs EP20K100FC324-2 Comparación
Comparación detallada lado a lado de EP20K100FC324-3 por Intel y EP20K100FC324-2 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP20K100FC324-3 | EP20K100FC324-2 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $42,10 | $18,90 |
| Series | APEX 20K | — |
| Family | APEX 20K (non-KE) | — |
| System Gates | 100,000 | — |
| Logic Elements | 4,160 | — |
| Maximum Logic Blocks | 26 | — |
| Embedded Memory (RAM bits) | 53,248 | — |
| User I/O Pins | 252 | — |
| Total RAM bits | 53,248 | — |
| Process Technology | 0.22 µm CMOS | — |
| Core Supply Voltage | 2.5 V | 2.5 V |
| Maximum Internal Frequency | 167 MHz | — |
| Propagation Delay | 1.6 ns | — |
| Speed Grade | -3 (slowest) | — |
| Encapsulado | 324-pin FBGA (Fine-pitch BGA) | 324-ball FBGA |
| Package Body Size | 45 x 45 mm | — |
| Ball Pitch | 1.27 mm | — |
| Temperatura de funcionamiento | 0 °C to 85 °C (Commercial) | 0°C to 85°C |
| Programming Interface | IEEE 1149.1 JTAG | — |
| Tipo de montaje | Surface Mount | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Device Family | — | APEX 20K |
| Equivalent Gates | — | 100,000 |
| Logic Cells | — | 4,160 |
| Maximum User I/Os | — | 252 |
| Recuento de pines | — | 324 |
| Technology Node | — | 0.22 µm CMOS |
| Propagation Delay (tPD) | — | 1.6 ns |
| Internal Performance | — | 200 MHz |
| Configuration Method | — | JTAG / serial configuration PROM |
| Embedded Memory | — | Dual-port RAM blocks (ESB) |
| Programming Toolchain | — | Altera Quartus / MAX+PLUS II |