EP20K100FC324-3 vs EP20K100FC324-2 Comparaison
Comparaison détaillée côte à côte de EP20K100FC324-3 par Intel et EP20K100FC324-2 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP20K100FC324-3 | EP20K100FC324-2 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $42,10 | $18,90 |
| Series | APEX 20K | — |
| Family | APEX 20K (non-KE) | — |
| System Gates | 100,000 | — |
| Logic Elements | 4,160 | — |
| Maximum Logic Blocks | 26 | — |
| Embedded Memory (RAM bits) | 53,248 | — |
| User I/O Pins | 252 | — |
| Total RAM bits | 53,248 | — |
| Process Technology | 0.22 µm CMOS | — |
| Core Supply Voltage | 2.5 V | 2.5 V |
| Maximum Internal Frequency | 167 MHz | — |
| Propagation Delay | 1.6 ns | — |
| Speed Grade | -3 (slowest) | — |
| Boîtier | 324-pin FBGA (Fine-pitch BGA) | 324-ball FBGA |
| Package Body Size | 45 x 45 mm | — |
| Ball Pitch | 1.27 mm | — |
| Température de fonctionnement | 0 °C to 85 °C (Commercial) | 0°C to 85°C |
| Programming Interface | IEEE 1149.1 JTAG | — |
| Type de montage | Surface Mount | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Device Family | — | APEX 20K |
| Equivalent Gates | — | 100,000 |
| Logic Cells | — | 4,160 |
| Maximum User I/Os | — | 252 |
| Nombre de broches | — | 324 |
| Technology Node | — | 0.22 µm CMOS |
| Propagation Delay (tPD) | — | 1.6 ns |
| Internal Performance | — | 200 MHz |
| Configuration Method | — | JTAG / serial configuration PROM |
| Embedded Memory | — | Dual-port RAM blocks (ESB) |
| Programming Toolchain | — | Altera Quartus / MAX+PLUS II |