EP20K400EFC672-2N vs EP20K400EFI672-2X Comparación
Comparación detallada lado a lado de EP20K400EFC672-2N por Intel y EP20K400EFI672-2X por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP20K400EFC672-2N | EP20K400EFI672-2X |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $171,00 | $168,00 |
| Family | APEX 20KE | APEX 20KE |
| Logic Elements / Cells | 16,640 | — |
| System Gates | 400,000 (1,052,032 max) | 400,000 |
| Maximum User I/Os | 488 | — |
| Encapsulado | 672-ball FC-FBGA | 672-ball FineLine BGA (FC-FBGA), 27 × 27 mm |
| Process Technology | 0.22 um CMOS | 0.22 µm CMOS |
| Core Supply Voltage (VCCINT) | 1.8 V | — |
| I/O Supply Voltage (VCCIO) | 2.5 V | — |
| Propagation Delay (tpd) | 2.5 ns | — |
| Internal Operating Frequency | [DATA_NEEDED: max internal frequency MHz] | — |
| Temperatura de funcionamiento | 0 C to +85 C (commercial) | 0 °C to 85 °C (Industrial) |
| Total Pins | 672 | — |
| Tipo de montaje | Surface Mount (FBGA) | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance] | Compliant |
| Configuration Interface | JTAG (IEEE 1149.1) + serial | — |
| Embedded Memory | Embedded System Blocks (ESBs) | 212,992 bits |
| Series | — | EP20K400E |
| Logic Elements | — | 16,640 |
| Maximum User I/O | — | 488 |
| Number of I/O Banks | — | 8 |
| PLLs | — | 4 |
| Core Voltage (VCCINT) | — | 1.71 V to 1.89 V (1.8 V nominal) |
| Maximum Internal Frequency | — | 223 MHz |
| Ball Pitch | — | 1.27 mm |
| Nivel de sensibilidad a la humedad (MSL) | — | 3 |
| Peak Reflow Temperature | — | 220 °C |
| Sin halógenos | — | Compliant |