EP20K400EFI672-2X vs EP20K400FI672-2X Comparación
Comparación detallada lado a lado de EP20K400EFI672-2X por Intel y EP20K400FI672-2X por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP20K400EFI672-2X | EP20K400FI672-2X |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $168,00 | $171,00 |
| Family | APEX 20KE | APEX 20K |
| Series | EP20K400E | — |
| Logic Elements | 16,640 | 16,640 |
| System Gates | 400,000 | — |
| Embedded Memory | 212,992 bits | 212,992 bits |
| Maximum User I/O | 488 | — |
| Number of I/O Banks | 8 | — |
| PLLs | 4 | — |
| Core Voltage (VCCINT) | 1.71 V to 1.89 V (1.8 V nominal) | — |
| Process Technology | 0.22 µm CMOS | 0.18 um CMOS, 6-metal |
| Maximum Internal Frequency | 223 MHz | — |
| Temperatura de funcionamiento | 0 °C to 85 °C (Industrial) | -40C to +85C (industrial) |
| Encapsulado | 672-ball FineLine BGA (FC-FBGA), 27 × 27 mm | 672-ball BGA (FI672) |
| Ball Pitch | 1.27 mm | — |
| Tipo de montaje | Surface Mount | — |
| Nivel de sensibilidad a la humedad (MSL) | 3 | — |
| Peak Reflow Temperature | 220 °C | — |
| Sin halógenos | Compliant | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS compliance] |
| Typical Gates | — | 400,000 system gates |
| User I/O Pins | — | 496 |
| Package Code | — | BGA |
| Terminal Form | — | Ball |
| No. of Terminals | — | 672 |
| Package Shape | — | Square |
| Speed Grade | — | -2X |
| Core Voltage | — | 1.8 V |
| I/O Voltage Support | — | 1.8V / 2.5V / 3.3V / 5V (MultiVolt) |
| Configuration Method | — | SRAM (serial EPROM or JTAG) |
| JTAG Support | — | Yes (IEEE 1149.1) |