EP20K400FI784-2 vs EP20K400FC784-2 Comparación
Comparación detallada lado a lado de EP20K400FI784-2 por Altera y EP20K400FC784-2 por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP20K400FI784-2 | EP20K400FC784-2 |
|---|---|---|
| Marca | Altera | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $82,40 | $175,00 |
| Device Family | APEX 20K | — |
| Typical Gates | 400,000 | — |
| Logic Elements (LEs) | [DATA_NEEDED: logic elements count] | — |
| Embedded System Blocks (ESBs) | [DATA_NEEDED: ESB count] | — |
| Maximum User I/O Pins | [DATA_NEEDED: user I/O count] | 488 (784-BGA) |
| Dedicated Inputs | 4 | — |
| Nominal Core Supply Voltage (VCCINT) | 2.5 V | — |
| VCCINT Range | 2.375 V to 2.625 V | — |
| Speed Grade | -2 | -2 (industrial) |
| Rango de temperatura de funcionamiento | -40 °C to +100 °C | — |
| Package Type | S-PBGA-B784 (FineLine BGA) | — |
| Package Pin Count | 784 balls | — |
| Ball Pitch | 1.000 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: not confirmed in provided data] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Nivel MSL | [DATA_NEEDED: MSL rating] | 3 (per Partstack listing) |
| Device Form Factor | Loadable PLD | — |
| Process Technology | [DATA_NEEDED: process node] | 0.22 µm CMOS SRAM |
| Configuration Memory | SRAM-based (volatile) | — |
| Family | — | APEX 20K |
| Device Family Member | — | EP20K400C |
| Typical System Gates | — | 400,000 |
| Logic Elements | — | 16,640 |
| Embedded RAM (ESB) | — | 212 Kbits |
| Maximum Block RAM | — | [DATA_NEEDED: block RAM organization per ESB] |
| Maximum Frequency (internal) | — | [DATA_NEEDED: fmax, datasheet-dependent] |
| Core Voltage | — | 2.5 V |
| MultiVolt I/O Voltage | — | 1.8 V / 2.5 V / 3.3 V |
| Supported I/O Standards | — | LVTTL, LVCMOS, PCI, SSTL-2, SSTL-3, GTL+, CTT |
| Configuration Mode | — | Serial / Parallel SRAM-volatile (external PROM required) |
| Encapsulado | — | 784-Ball FineLine BGA (FC) |
| Temperatura de funcionamiento | — | [DATA_NEEDED: exact Tj range] |
| Peak Reflow Temperature | — | 220 °C (per Partstack listing) |
| Hot Socketing | — | Supported |
| JTAG / Boundary-Scan | — | IEEE 1149.1 compliant |