EP20K400FI784-2 vs EP20K400FC784-2 Comparaison
Comparaison détaillée côte à côte de EP20K400FI784-2 par Altera et EP20K400FC784-2 par Altera. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP20K400FI784-2 | EP20K400FC784-2 |
|---|---|---|
| Marque | Altera | Altera |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $82,40 | $175,00 |
| Device Family | APEX 20K | — |
| Typical Gates | 400,000 | — |
| Logic Elements (LEs) | [DATA_NEEDED: logic elements count] | — |
| Embedded System Blocks (ESBs) | [DATA_NEEDED: ESB count] | — |
| Maximum User I/O Pins | [DATA_NEEDED: user I/O count] | 488 (784-BGA) |
| Dedicated Inputs | 4 | — |
| Nominal Core Supply Voltage (VCCINT) | 2.5 V | — |
| VCCINT Range | 2.375 V to 2.625 V | — |
| Speed Grade | -2 | -2 (industrial) |
| Plage de température de fonctionnement | -40 °C to +100 °C | — |
| Package Type | S-PBGA-B784 (FineLine BGA) | — |
| Package Pin Count | 784 balls | — |
| Ball Pitch | 1.000 mm | — |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Statut RoHS | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: not confirmed in provided data] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Niveau MSL | [DATA_NEEDED: MSL rating] | 3 (per Partstack listing) |
| Device Form Factor | Loadable PLD | — |
| Process Technology | [DATA_NEEDED: process node] | 0.22 µm CMOS SRAM |
| Configuration Memory | SRAM-based (volatile) | — |
| Family | — | APEX 20K |
| Device Family Member | — | EP20K400C |
| Typical System Gates | — | 400,000 |
| Logic Elements | — | 16,640 |
| Embedded RAM (ESB) | — | 212 Kbits |
| Maximum Block RAM | — | [DATA_NEEDED: block RAM organization per ESB] |
| Maximum Frequency (internal) | — | [DATA_NEEDED: fmax, datasheet-dependent] |
| Core Voltage | — | 2.5 V |
| MultiVolt I/O Voltage | — | 1.8 V / 2.5 V / 3.3 V |
| Supported I/O Standards | — | LVTTL, LVCMOS, PCI, SSTL-2, SSTL-3, GTL+, CTT |
| Configuration Mode | — | Serial / Parallel SRAM-volatile (external PROM required) |
| Boîtier | — | 784-Ball FineLine BGA (FC) |
| Température de fonctionnement | — | [DATA_NEEDED: exact Tj range] |
| Peak Reflow Temperature | — | 220 °C (per Partstack listing) |
| Hot Socketing | — | Supported |
| JTAG / Boundary-Scan | — | IEEE 1149.1 compliant |