EP20K400FI784-3 vs EP20K400FI784-2 Comparación
Comparación detallada lado a lado de EP20K400FI784-3 por Intel y EP20K400FI784-2 por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP20K400FI784-3 | EP20K400FI784-2 |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $155,00 | $82,40 |
| Family | APEX 20K | — |
| Typical Gate Count | 400,000 gates | — |
| Logic Elements | [DATA_NEEDED: exact LE count] | — |
| Dedicated Inputs | 4 | 4 |
| Embedded System Blocks (ESBs) | [DATA_NEEDED: ESB count] | [DATA_NEEDED: ESB count] |
| Maximum User I/O | [DATA_NEEDED: user I/O count] | — |
| Supply Voltage (Nominal) | 2.5 V | — |
| Supply Voltage Range | 2.375 V to 2.625 V | — |
| Speed Grade | -3 (slowest) | -2 |
| Temperatura de funcionamiento | -40 °C to +100 °C (industrial) | — |
| Encapsulado | 784-ball PBGA (Fine-pitch BGA) | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| Terminal Pitch | 1.000 mm | — |
| Seated Height (max) | 2.7000 mm | — |
| Body Material | Plastic / Epoxy | — |
| Nivel MSL | 3 | [DATA_NEEDED: MSL rating] |
| Configuration Method | SRAM (external EPROM required) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Process Technology | 0.18 µm CMOS SRAM | [DATA_NEEDED: process node] |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance] |
| Device Family | — | APEX 20K |
| Typical Gates | — | 400,000 |
| Logic Elements (LEs) | — | [DATA_NEEDED: logic elements count] |
| Maximum User I/O Pins | — | [DATA_NEEDED: user I/O count] |
| Nominal Core Supply Voltage (VCCINT) | — | 2.5 V |
| VCCINT Range | — | 2.375 V to 2.625 V |
| Rango de temperatura de funcionamiento | — | -40 °C to +100 °C |
| Package Type | — | S-PBGA-B784 (FineLine BGA) |
| Package Pin Count | — | 784 balls |
| Ball Pitch | — | 1.000 mm |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| Device Form Factor | — | Loadable PLD |
| Configuration Memory | — | SRAM-based (volatile) |