EP20K400FI784-3 vs EP20K400FI784-2 Comparaison
Comparaison détaillée côte à côte de EP20K400FI784-3 par Intel et EP20K400FI784-2 par Altera. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP20K400FI784-3 | EP20K400FI784-2 |
|---|---|---|
| Marque | Intel | Altera |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $155,00 | $82,40 |
| Family | APEX 20K | — |
| Typical Gate Count | 400,000 gates | — |
| Logic Elements | [DATA_NEEDED: exact LE count] | — |
| Dedicated Inputs | 4 | 4 |
| Embedded System Blocks (ESBs) | [DATA_NEEDED: ESB count] | [DATA_NEEDED: ESB count] |
| Maximum User I/O | [DATA_NEEDED: user I/O count] | — |
| Supply Voltage (Nominal) | 2.5 V | — |
| Supply Voltage Range | 2.375 V to 2.625 V | — |
| Speed Grade | -3 (slowest) | -2 |
| Température de fonctionnement | -40 °C to +100 °C (industrial) | — |
| Boîtier | 784-ball PBGA (Fine-pitch BGA) | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| Terminal Pitch | 1.000 mm | — |
| Seated Height (max) | 2.7000 mm | — |
| Body Material | Plastic / Epoxy | — |
| Niveau MSL | 3 | [DATA_NEEDED: MSL rating] |
| Configuration Method | SRAM (external EPROM required) | — |
| Type de montage | Surface Mount | Surface Mount |
| Process Technology | 0.18 µm CMOS SRAM | [DATA_NEEDED: process node] |
| Statut RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance] |
| Device Family | — | APEX 20K |
| Typical Gates | — | 400,000 |
| Logic Elements (LEs) | — | [DATA_NEEDED: logic elements count] |
| Maximum User I/O Pins | — | [DATA_NEEDED: user I/O count] |
| Nominal Core Supply Voltage (VCCINT) | — | 2.5 V |
| VCCINT Range | — | 2.375 V to 2.625 V |
| Plage de température de fonctionnement | — | -40 °C to +100 °C |
| Package Type | — | S-PBGA-B784 (FineLine BGA) |
| Package Pin Count | — | 784 balls |
| Ball Pitch | — | 1.000 mm |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| Device Form Factor | — | Loadable PLD |
| Configuration Memory | — | SRAM-based (volatile) |