EP20K600CF672 vs EP20K600CF672C8N Comparación

Comparación detallada lado a lado de EP20K600CF672 por Intel y EP20K600CF672C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Intel
EP20K600CF672 EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel

EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel

EP20K600CF672 [data_needed: lifecycle status]

Comparación de especificaciones

Parámetro EP20K600CF672 EP20K600CF672C8N
Marca Intel Intel
Categoría FPGA & CPLD FPGA & CPLD
Estado del ciclo de vida [DATA NEEDED: Lifecycle Status] Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $0,00 $108,00
Product Type Field-Programmable Gate Array (FPGA) FPGA / programmable logic device
Product Family APEX-20KC —
Manufacturer Altera / Intel —
User I/O Lines 508 I/O —
Logic Elements [DATA_NEEDED: logic element count] —
Propagation Delay 1.48 ns for supplied EP20K600CF672C9N/C8N references 1.48 ns
Device Type Listed by Supplied References SPLD —
Process Technology 0.15 um all-layer copper-metal process for supplied family references —
Performance Claim Up to 35% faster than APEX 20KE devices —
Package Type 672-ball BGA, FCBGA —
Package Dimensions 45 mm x 45 mm —
Ball Pitch 1.27 mm —
Tipo de montaje Surface Mount Surface mount
Temperatura de funcionamiento 0 C to 85 C for supplied EP20K600CF672C9N/C8N references 0°C to 85°C
Configuration Device Type Enhanced Configuration (EPC) device —
Core Voltage [DATA_NEEDED: core supply voltage] —
I/O Voltage [DATA_NEEDED: I/O supply voltage] —
Configuration Memory [DATA_NEEDED: configuration memory type and capacity] —
Embedded Memory [DATA_NEEDED: embedded memory capacity] —
Estado RoHS unknown unknown
REACH Status unknown unknown
AEC-Q100 Status unknown —
Device Type — SPLD
Family — APEX 20KC
Nominal Gate Capacity — 600K gates
Logic Elements or Cells — 24,320
Macros — 2,432
User I/O Count — 508
Package Terminals — 652 pins
Encapsulado — BGA-652, 45 x 45 mm, 1.27 mm pitch
Package Description — 672-pin FC-FBGA
Tensión de alimentación — 1.8 V
Listed Frequency — 301.21 MHz
Fabrication Process — 0.15 µm
Interconnect Metal — All-layer copper metal
I/O Configuration — 508 user I/O
AEC-Q100 Qualification — unknown
Configuration Method — [DATA_NEEDED: configuration memory and programming method]
Core Current — [DATA_NEEDED: core supply current]
I/O Bank Voltage — [DATA_NEEDED: supported I/O voltage range]
Junction Temperature — [DATA_NEEDED: maximum junction temperature]
Resistencia térmica — [DATA_NEEDED: junction-to-ambient thermal resistance]

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