EP20K600CF672 vs EP20K600CF672C8N Comparaison

Comparaison détaillée côte à côte de EP20K600CF672 par Intel et EP20K600CF672C8N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.

Intel
EP20K600CF672 EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel

EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel

EP20K600CF672 [data_needed: lifecycle status]

Comparaison des spécifications

Paramètre EP20K600CF672 EP20K600CF672C8N
Marque Intel Intel
Catégorie FPGA & CPLD FPGA & CPLD
Statut du cycle de vie [DATA NEEDED: Lifecycle Status] Actif
Statut du stock In Stock In Stock
Prix unitaire (USD) $0,00 $108,00
Product Type Field-Programmable Gate Array (FPGA) FPGA / programmable logic device
Product Family APEX-20KC —
Manufacturer Altera / Intel —
User I/O Lines 508 I/O —
Logic Elements [DATA_NEEDED: logic element count] —
Propagation Delay 1.48 ns for supplied EP20K600CF672C9N/C8N references 1.48 ns
Device Type Listed by Supplied References SPLD —
Process Technology 0.15 um all-layer copper-metal process for supplied family references —
Performance Claim Up to 35% faster than APEX 20KE devices —
Package Type 672-ball BGA, FCBGA —
Package Dimensions 45 mm x 45 mm —
Ball Pitch 1.27 mm —
Type de montage Surface Mount Surface mount
Température de fonctionnement 0 C to 85 C for supplied EP20K600CF672C9N/C8N references 0°C to 85°C
Configuration Device Type Enhanced Configuration (EPC) device —
Core Voltage [DATA_NEEDED: core supply voltage] —
I/O Voltage [DATA_NEEDED: I/O supply voltage] —
Configuration Memory [DATA_NEEDED: configuration memory type and capacity] —
Embedded Memory [DATA_NEEDED: embedded memory capacity] —
Statut RoHS unknown unknown
REACH Status unknown unknown
AEC-Q100 Status unknown —
Device Type — SPLD
Family — APEX 20KC
Nominal Gate Capacity — 600K gates
Logic Elements or Cells — 24,320
Macros — 2,432
User I/O Count — 508
Package Terminals — 652 pins
Boîtier — BGA-652, 45 x 45 mm, 1.27 mm pitch
Package Description — 672-pin FC-FBGA
Tension d'alimentation — 1.8 V
Listed Frequency — 301.21 MHz
Fabrication Process — 0.15 µm
Interconnect Metal — All-layer copper metal
I/O Configuration — 508 user I/O
AEC-Q100 Qualification — unknown
Configuration Method — [DATA_NEEDED: configuration memory and programming method]
Core Current — [DATA_NEEDED: core supply current]
I/O Bank Voltage — [DATA_NEEDED: supported I/O voltage range]
Junction Temperature — [DATA_NEEDED: maximum junction temperature]
Résistance thermique — [DATA_NEEDED: junction-to-ambient thermal resistance]

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