EP2A15B652C7 vs EP2A25B652C7 Comparación
Comparación detallada lado a lado de EP2A15B652C7 por Intel y EP2A25B652C7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2A15B652C7 | EP2A25B652C7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $82,40 | $285,00 |
| Family | APEX II | APEX II |
| Logic Elements | 30000 (approx) | Approximately 25,000 LE |
| Typical Gates | 1.5 million | — |
| Maximum User I/O Pins | [DATA_NEEDED: exact user I/O count] | 488 |
| Process Technology | 0.18 micron CMOS | — |
| Embedded System Blocks (ESB) | Yes - configurable as RAM/ROM or product-term logic | — |
| Supply Voltage - Core | [DATA_NEEDED: VCCINT voltage] | — |
| Supply Voltage - I/O | [DATA_NEEDED: VCCIO voltage] | — |
| Configuration Method | SRAM-based, requires external configuration memory | JTAG / Passive Serial / Active Serial |
| Speed Grade | -7 | -7 |
| Temperatura de funcionamiento | 0C to +85C (commercial, suffix C7) | Commercial 0C to +85C |
| Encapsulado | 652-ball BGA | 652-ball FineLine BGA |
| Tipo de montaje | Surface Mount | — |
| Hot Socketing Support | Yes (MultiCore hot-socketing) | — |
| Estado RoHS | [DATA_NEEDED: RoHS status - legacy APEX II family] | [DATA_NEEDED: RoHS status] |
| Design Tool | Quartus II (legacy) | — |
| Embedded System Blocks (ESBs) | — | [DATA_NEEDED: ESB count] |
| Core Voltage | — | 1.5 V |
| I/O Bank Voltage | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| RAM Bits (approx.) | — | 40,960 |
| PLLs | — | 4 |
| Supported I/O Standards | — | LVTTL, LVCMOS, SSTL, LVDS |
| Boundary Scan | — | IEEE 1149.1 compliant |
| Design Software | — | Quartus II |