EP2A15B724C9 vs EP2A25B724-C7 Comparación
Comparación detallada lado a lado de EP2A15B724C9 por Intel y EP2A25B724-C7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2A15B724C9 | EP2A25B724-C7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $268,50 | $195,00 |
| Series | APEX II | — |
| Family | APEX II (EP2A15) | APEX II |
| Logic Elements | 16640 | 24,320 |
| Number of Gates | 600000 | — |
| Embedded Memory (RAM bits) | 425984 | — |
| User I/O Count | 492 | — |
| Supply Voltage (Core) | 1.5 V | — |
| I/O Voltages Supported | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) | — |
| Process Technology | 0.15 µm all-layer copper (up to 8 metal layers) | 0.15 µm all-layer copper, up to 8 metal layers |
| Maximum Internal Frequency | 500 MHz | — |
| LVDS Data Rate | Up to 1 Gbps (True-LVDS) | — |
| Interface Standards | LVDS, LVPECL, PCML, HyperTransport | — |
| Embedded Memory Type | ESB - dual-port RAM / ROM / FIFO / CAM | — |
| Clock Management | On-chip PLLs | — |
| Encapsulado | 724-ball FCBGA (Fine-pitch Chip-Scale BGA) | 724-BBGA, FCBGA |
| Temperatura de funcionamiento | Commercial (0 °C to +85 °C) | Commercial (0C to +85C) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Device | — | EP2A25 |
| System Gates | — | 622,592 |
| User I/Os | — | 540 |
| Core Voltage | — | 1.5 V |
| High-Speed Interface | — | True-LVDS, LVPECL, PCML, HyperTransport up to 1 Gbps |
| Embedded Memory (ESB) | — | Configurable as 4 Kbit SRAM or product-term logic per ESB |
| PLLs | — | Up to 8 |
| Multi-Voltage I/O | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V banks |
| Speed Grade | — | C7 |