EP2A15B724C9 vs EP2A25B724-C7 Comparaison
Comparaison détaillée côte à côte de EP2A15B724C9 par Intel et EP2A25B724-C7 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2A15B724C9 | EP2A25B724-C7 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $268,50 | $195,00 |
| Series | APEX II | — |
| Family | APEX II (EP2A15) | APEX II |
| Logic Elements | 16640 | 24,320 |
| Number of Gates | 600000 | — |
| Embedded Memory (RAM bits) | 425984 | — |
| User I/O Count | 492 | — |
| Supply Voltage (Core) | 1.5 V | — |
| I/O Voltages Supported | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) | — |
| Process Technology | 0.15 µm all-layer copper (up to 8 metal layers) | 0.15 µm all-layer copper, up to 8 metal layers |
| Maximum Internal Frequency | 500 MHz | — |
| LVDS Data Rate | Up to 1 Gbps (True-LVDS) | — |
| Interface Standards | LVDS, LVPECL, PCML, HyperTransport | — |
| Embedded Memory Type | ESB - dual-port RAM / ROM / FIFO / CAM | — |
| Clock Management | On-chip PLLs | — |
| Boîtier | 724-ball FCBGA (Fine-pitch Chip-Scale BGA) | 724-BBGA, FCBGA |
| Température de fonctionnement | Commercial (0 °C to +85 °C) | Commercial (0C to +85C) |
| Type de montage | Surface Mount | Surface Mount |
| Statut RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Device | — | EP2A25 |
| System Gates | — | 622,592 |
| User I/Os | — | 540 |
| Core Voltage | — | 1.5 V |
| High-Speed Interface | — | True-LVDS, LVPECL, PCML, HyperTransport up to 1 Gbps |
| Embedded Memory (ESB) | — | Configurable as 4 Kbit SRAM or product-term logic per ESB |
| PLLs | — | Up to 8 |
| Multi-Voltage I/O | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V banks |
| Speed Grade | — | C7 |