EP2A25F672C8N vs EP2A15F672C7N Comparación
Comparación detallada lado a lado de EP2A25F672C8N por Intel y EP2A15F672C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2A25F672C8N | EP2A15F672C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $205,00 | $171,00 |
| Family | APEX II | APEX II |
| Technology Node | 0.15 um all-layer copper process | — |
| System Gates | 900,000 | — |
| Logic Elements / Cells | 24,320 | — |
| Maximum Internal Frequency | 333 MHz | 500 MHz |
| Propagation Delay | 1.69 ns | — |
| User I/Os | 492 | 492 |
| Encapsulado | 672-ball FC-FBGA (FineLine BGA) | 672-ball FC-FBGA (FineLine BGA) |
| Package Body Size | 27 x 27 mm | — |
| Ball Pitch | 1.0 mm | — |
| Core Supply Voltage | 1.5 V | — |
| Speed Grade | C8 | -7 |
| Temperatura de funcionamiento | 0 C to 85 C (commercial) | Commercial (0C to +85C) |
| Multi-Gigabit Transceiver Rate | Up to 1 Gbps per channel | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free Suffix | N (lead-free, Pb-free finish) | — |
| Logic Elements (Cells) | — | 16,640 |
| Embedded Memory Bits | — | 425,984 |
| Process Technology | — | 0.15 µm all-layer copper CMOS |
| Metal Layers | — | Up to 8 |
| Core Voltage | — | 1.5 V |
| I/O Standards Supported | — | LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL |
| LVDS Data Rate | — | Up to 1 Gbps (True-LVDS) |
| Configuration Methods | — | JTAG, Passive Serial |