EP2A25F672I6 vs EP2A25F672C7N Comparación
Comparación detallada lado a lado de EP2A25F672I6 por Intel y EP2A25F672C7N por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2A25F672I6 | EP2A25F672C7N |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $178,00 | $195,00 |
| Family | APEX II | APEX II |
| Logic Elements (typical gates) | 25,000 | — |
| Fabric Architecture | SRAM-based LUT | — |
| Process Technology | 0.18 µm CMOS | 0.15 µm all-layer copper (up to 8 metal layers) |
| Encapsulado | 672-ball FineLine BGA (FBGA-672) | — |
| Core Voltage | 1.5 V | — |
| Configuration Method | External SRAM configuration device (EPC series) | — |
| Temperature Grade | Industrial (-40 °C to +100 °C ambient) | — |
| Speed Grade | 6 | — |
| Embedded Memory | Embedded System Blocks (ESB), dual-port RAM / CAM | Embedded System Blocks (ESB) configurable as dual-port RAM/ROM |
| DSP Blocks | MultiCore dedicated multipliers | — |
| Boundary Scan | JTAG (IEEE 1149.1) compliant | — |
| Clock Management | Dedicated PLL / clock tree circuitry | — |
| I/O Bank Count | [DATA_NEEDED: number of user I/O banks] | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Nivel MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Logic Elements | — | 24,320 cells |
| System Gates | — | Approximately 900,000 |
| User I/Os | — | 492 |
| Propagation Delay (tPD) | — | 1.69 ns |
| Internal Operating Frequency | — | Up to 500 MHz |
| Core Voltage (VCCINT) | — | 1.5 V |
| Logic Family | — | CMOS |
| Package Type | — | 672-ball FC-FBGA (FineLine BGA) |
| Package Body Size | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Temperatura de funcionamiento | — | 0 °C to 85 °C (commercial) |
| High-Speed I/O Support | — | True-LVDS, LVPECL, PCML, HyperTransport up to 1 Gbps |
| Programmable Logic Type | — | Loadable PLD (in-system programmable) |
| PLLs | — | Up to 4 |