EP2A25F672I6 vs EP2A25F672C7N 비교

다음의 상세 나란히 비교: EP2A25F672I6 제조: Intel 및 EP2A25F672C7N 제조: Altera. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

사양 비교

파라미터 EP2A25F672I6 EP2A25F672C7N
브랜드 Intel Altera
카테고리 FPGA & CPLD FPGA & CPLD
수명 주기 상태 NRND Obsolete
재고 상태 In Stock In Stock
단가 (USD) $178.00 $195.00
Family APEX II APEX II
Logic Elements (typical gates) 25,000 —
Fabric Architecture SRAM-based LUT —
Process Technology 0.18 µm CMOS 0.15 µm all-layer copper (up to 8 metal layers)
패키지 672-ball FineLine BGA (FBGA-672) —
Core Voltage 1.5 V —
Configuration Method External SRAM configuration device (EPC series) —
Temperature Grade Industrial (-40 °C to +100 °C ambient) —
Speed Grade 6 —
Embedded Memory Embedded System Blocks (ESB), dual-port RAM / CAM Embedded System Blocks (ESB) configurable as dual-port RAM/ROM
DSP Blocks MultiCore dedicated multipliers —
Boundary Scan JTAG (IEEE 1149.1) compliant —
Clock Management Dedicated PLL / clock tree circuitry —
I/O Bank Count [DATA_NEEDED: number of user I/O banks] —
RoHS 상태 [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS compliance]
Lead-Free [DATA_NEEDED: lead-free status] —
MSL 레벨 [DATA_NEEDED: moisture sensitivity level] —
실장 유형 Surface Mount (BGA) Surface Mount
Logic Elements — 24,320 cells
System Gates — Approximately 900,000
User I/Os — 492
Propagation Delay (tPD) — 1.69 ns
Internal Operating Frequency — Up to 500 MHz
Core Voltage (VCCINT) — 1.5 V
Logic Family — CMOS
Package Type — 672-ball FC-FBGA (FineLine BGA)
Package Body Size — 27 x 27 mm
Ball Pitch — 1.0 mm
동작 온도 — 0 °C to 85 °C (commercial)
High-Speed I/O Support — True-LVDS, LVPECL, PCML, HyperTransport up to 1 Gbps
Programmable Logic Type — Loadable PLD (in-system programmable)
PLLs — Up to 4

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