EP2A40F1020C8N vs EP2A40F1020C9N Comparación
Comparación detallada lado a lado de EP2A40F1020C8N por Intel y EP2A40F1020C9N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2A40F1020C8N | EP2A40F1020C9N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $175,00 |
| Product Type | Field-Programmable Gate Array (FPGA) | — |
| Device Family | APEX II | — |
| Logic Technology | CMOS | — |
| Logic Gates | 1.5 million | — |
| Logic Cells | 38,400 | — |
| Nominal Supply Voltage | 1.5 V | — |
| Supply Voltage Range | 1.425 V to 1.575 V | — |
| User I/Os | 735 | — |
| Package Terminal Count | 1,020 pins | — |
| Package Type | FC-FBGA, BGA-1020 | — |
| Package Body Size | 33 mm x 33 mm | — |
| Ball Pitch | 1 mm | — |
| Reported Operating Frequency | 376 MHz | — |
| Alternative Reported Frequency | 562 MHz | — |
| Reported Propagation Delay | 1.78 ns | — |
| Alternative Reported Propagation Delay | 1.55 ns | — |
| Fabrication Process | 0.15 µm | — |
| Maximum Reported Metal Layers | 8 layers | — |
| Temperatura de funcionamiento | 0 °C to 85 °C | 0 °C to 85 °C |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Terminal Form | Ball | — |
| Estado RoHS | unknown | unknown |
| REACH Status | unknown | — |
| AEC-Q100 Qualification | unknown | — |
| Family | — | APEX II |
| Series | — | EP2A40 |
| Device Type | — | FPGA (Field-Programmable Gate Array) |
| Logic Family | — | CMOS |
| System Gates | — | 1.5 M |
| Logic Cells / Elements | — | 38,400 |
| Maximum Operating Frequency | — | 366 MHz |
| Propagation Delay | — | 1.55 ns |
| Core Voltage | — | 1.5 V |
| Process Technology | — | 0.15 µm all-layer copper (up to 8 metal layers) |
| User I/O Pins | — | 735 |
| Total Pins | — | 1020 |
| Encapsulado | — | 1020-ball FC-FBGA, 33 × 33 mm, 1 mm pitch, FineLine |
| I/O Standards | — | True-LVDS, LVPECL, PCML, HyperTransport, LVTTL, LVCMOS, PCI, GTL+, SSTL |
| Configuration Modes | — | Passive Serial, Passive Parallel, JTAG |
| On-chip Memory | — | Embedded System Blocks (ESB) for RAM/ROM |