EP2A40F1020C9N - APEX II 1.5M Gates FPGA, 1020-BGA | Intel
N.º de pieza: EP2A40F1020C9N ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $252 | $2.520,00 |
| 50 | $224 | $11.200,00 |
| 100 | $198 | $19.800,00 |
| 500 | $175 | $87.500,00 |
EP2A40F1020C9N Descripción general
A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that lets designers implement custom digital logic via a hardware description language. Within the broader taxonomy, an FPGA sits under programmable logic devices (PLD), then logic ICs, then integrated circuits, then semiconductors. The APEX II family specifically targets high-performance data-path and communications applications where both logic density and rich I/O count are required.
Key features of the EP2A40F1020C9N include 38,400 logic cells, 1.5M system gates, embedded system blocks (ESBs) for RAM and ROM, and a MultiCore architecture that places four logic array blocks (LABs) per row for fine-grained timing control. The device supports in-circuit reconfigurability via passive serial, passive parallel, and JTAG interfaces, enabling live firmware updates in deployed systems.
Architecturally, the EP2A40 uses a MultiCore interconnect with DirectDrive technology, ensuring predictable routing delays across the die. The 0.15-µm process with eight copper layers provides superior signal integrity at high toggle rates, and the on-chip Phase-Locked Loops (PLLs) deliver flexible clock management for multi-domain designs. The 33 × 33 mm BGA-1020 package with 1 mm pitch supports high-density board layouts while exposing 735 user I/Os for parallel bus or LVDS SERDES interfaces.
Typical applications include high-speed data-path designs such as telecommunications switching, SONET/SDH framer/mapper ICs, high-end router line cards, and DSP co-processing cards. It is also well-suited for ASIC prototyping where 1.5M gates of capacity let designers emulate large SoCs before tape-out. When designing with this FPGA, allocate sufficient decoupling and provide thermal relief via the exposed die paddle. Engineers should also note that the APEX II family is end-of-life — verify second-source or replacement strategy before committing to new designs.
Alternativas directas para EP2A40F1020C9N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP2A40F1020C9N (mismo factor de forma y huella) — difiere en Package, Process Technology, System Gates, Operating Temperature, Logic Elements.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP2A40F1020C8N
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →EP2A40F1020C7N
✅ Sustitución directa✓ En stock
$198 / unidad
Ver hoja de datos →EP2A40F1020C6N
✅ Sustitución directa✓ En stock
$198 / unidad
Ver hoja de datos →EP2A40B724C9N
✅ Sustitución directa✓ En stock
$99.5 / unidad
Ver hoja de datos →EP2A40B724C8N
✅ Sustitución directa✓ En stock
$199.5 / unidad
Ver hoja de datos →EP2A40F1020C9N Valores máximos y características eléctricas
| Family | APEX II |
| Series | EP2A40 |
| Device Type | FPGA (Field-Programmable Gate Array) |
| Logic Family | CMOS |
| System Gates | 1.5 M |
| Logic Cells / Elements | 38,400 |
| Maximum Operating Frequency | 366 MHz |
| Propagation Delay | 1.55 ns |
| Core Voltage | 1.5 V |
| Process Technology | 0.15 µm all-layer copper (up to 8 metal layers) |
| User I/O Pins | 735 |
| Total Pins | 1020 |
| Encapsulado | 1020-ball FC-FBGA, 33 × 33 mm, 1 mm pitch, FineLine |
| Temperatura de funcionamiento | 0 °C to 85 °C |
| I/O Standards | True-LVDS, LVPECL, PCML, HyperTransport, LVTTL, LVCMOS, PCI, GTL+, SSTL |
| Configuration Modes | Passive Serial, Passive Parallel, JTAG |
| On-chip Memory | Embedded System Blocks (ESB) for RAM/ROM |
| Tipo de montaje | Surface Mount (BGA) |
| Estado RoHS | unknown |
Guía de configuración de pines de EP2A40F1020C9N 1020-ball fc-fbga, 33 × 33 mm, 1 mm pitch, fineline
Configuración de pines para EP2A40F1020C9N (encapsulado 1020-ball fc-fbga, 33 × 33 mm, 1 mm pitch, fineline). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP2A40F1020C9N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP2A40F1020C9N es adecuado para 6 aplicacións: Telecommunications Switching, SONET/SDH Framer and Mapper, ASIC Prototyping and Emulation, High-End Router Line Cards, DSP Co-Processing Cards, Industrial Test and Measurement.
Telecommunications Switching
The EP2A40F1020C9N's 1.5M system gates and 735 user I/Os make it well suited to high-density telecom switching fabrics. Per the APEX II datasheet DS-APEXII-3, the device's 1 Gbps True-LVDS and LVPECL capability delivers the parallel interconnect required by crossbar switches and TDM backplanes. Compared with discrete logic implementations, an FPGA fabric lets designers change port counts and arbitration policies through firmware rather than board rework. Use the device's embedded system blocks for connection-memory lookup tables and dedicate LAB rows to high-priority traffic for deterministic latency.
Recomendado
SONET/SDH Framer and Mapper
The EP2A40F1020C9N supports SONET/SDH framers and mappers that require precise clock recovery and high parallel lane count. According to the APEX II datasheet DS-APEXII-3, the 0.15 µm all-layer copper process gives the timing margin needed for OC-192-class designs, while on-chip PLLs clean up recovered clocks. The 38,400 logic elements hold full STS-1/STS-3 path and section overhead processing, while 735 user I/Os expose 10-bit or 16-bit parallel bus interfaces to PHY devices. Compared with ASICs, the FPGA's reconfigurability lets designers update framing as standards evolve.
Recomendado
ASIC Prototyping and Emulation
The EP2A40F1020C9N's 1.5M gates of capacity make it ideal for ASIC prototyping of large SoC designs before tape-out. Per distributor specifications, 38,400 logic elements hold substantial portions of a multi-million-gate ASIC, while in-circuit reconfigurability via JTAG and passive serial modes accelerates iteration cycles. The 735 user I/Os expose wide parallel buses for memory and peripheral emulation. Compared with smaller FPGAs, the EP2A40 reduces multi-chip partitioning overhead and lets designers validate timing closure in silicon rather than simulation alone.
Recomendado
High-End Router Line Cards
The EP2A40F1020C9N delivers the parallel logic and I/O bandwidth needed in router line cards handling 10 Gbps Ethernet, POS, and ATM. According to the APEX II datasheet DS-APEXII-3, the 1 Gbps True-LVDS interfaces handle SFI-4 connections to network processors, and 735 user I/Os expose packet-classification and traffic-management datapaths. The 1.5 V core reduces per-bit switching power relative to older 2.5 V families. Compared with ASIC NPU designs, the EP2A40 lets designers add new protocols and QoS features through firmware updates without respinning line-card hardware.
Recomendado
DSP Co-Processing Cards
The EP2A40F1020C9N's 38,400 logic elements and embedded system blocks make it well suited to DSP co-processing, where the FPGA accelerates FIR filters, FFTs, and baseband signal processing. Per the APEX II datasheet DS-APEXII-3, the on-chip ESB memory provides local coefficient and sample storage, while the 0.15 µm process supports the toggle rates required for high-throughput DSP datapaths. The 366 MHz internal clock rate is sufficient for many baseband and intermediate-frequency processing tasks. Compared with dedicated DSP chips, the FPGA's parallel fabric can process multiple streams simultaneously with deterministic latency.
Recomendado
Industrial Test and Measurement
The EP2A40F1020C9N's parallel architecture and rich I/O count make it valuable in industrial test equipment such as protocol analyzers, bit-error-rate testers, and boundary-scan controllers. Per Jotrin Electronics specifications, the device's 735 user I/Os expose enough parallel channels for multi-lane bus monitoring, while embedded system blocks buffer captured transactions. Compared with discrete logic, an FPGA-based design lets test vendors add protocol updates and customer-specific features without reworking hardware, shortening time-to-market for new compliance standards.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP2A40F1020C9N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP2A40F1020C8N | EP2A40F1020C7N | EP2A40F1020C6N | EP2A40B724C9N | EP2A40B724C8N |
|---|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA (33 × 33 mm) | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 724-ball BGA - different | 724-ball BGA - different |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Family | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II |
| System Gates | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M |
| Logic Elements | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| Speed Grade | C9 | C8 | C7 | C6 | C9 | C8 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Diferenciadores clave
- Highest speed grade in the APEX II EP2A40 family (frente a EP2A40F1020C8N)
- Maximum user I/O count via 1020-ball BGA (frente a EP2A40B724C9N)
- Direct replacement for same-package speed-grade alternatives (frente a EP2A40F1020C7N)
Notas de diseño
The EP2A40F1020C9N is housed in a 33 × 33 mm FC-FBGA package without an exposed die paddle. For designs in 0 to 85 °C environments, provide thermal relief through PCB copper pour under the device, ideally a 6 × 6 grid of thermal vias to internal ground planes. At 366 MHz toggle rates the device draws measurable core current; thermal analysis should include worst-case junction temperature under sustained traffic patterns.
Route the 1020-ball BGA with microvia technology on at least the top two signal layers to fan out the 1 mm pitch balls. Use a four-layer or six-layer stackup with continuous power planes adjacent to the BGA breakout zone to maintain signal integrity for 1 Gbps True-LVDS interfaces. Decouple every VCCIO bank with 0.1 µF and 10 µF capacitors placed within 100 mil of the balls per the APEX II datasheet DS-APEXII-3.
The APEX II family requires Quartus II version 9.0 or earlier for bitstream generation; newer Quartus versions do not support APEX II. Configuration via JTAG must respect the VCCINT ramp sequence; do not assert nCONFIG until VCCINT and VCCIO are within tolerance. Mismatched bank voltages between JTAG and configuration pins can permanently damage the device — review bank voltage assignments before PCB layout finalization.
Información de cumplimiento
APEX II family is obsolete as of late 2000s; original Altera/Intel datasheets do not explicitly state RoHS or REACH compliance. AEC-Q100 does not apply to FPGAs.
