EP2A70B724C9ES vs EP2A70B724C7 Comparación
Comparación detallada lado a lado de EP2A70B724C9ES por Intel y EP2A70B724C7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP2A70B724C9ES - APEX II FPGA 3M Gates 67200 Cells 724-FCBGA | Intel
EP2A70B724C9ES ⚠ Última compraComparación de especificaciones
| Parámetro | EP2A70B724C9ES | EP2A70B724C7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Unknown |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.250,00 | $0,00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | APEX II | — |
| Logic Elements / Cells | 67200 | — |
| System Gates | 3,000,000 (3M) | — |
| Embedded Memory (bits) | 1,146,880 | — |
| Maximum User I/O | 540 | — |
| Operating Frequency (max) | 198 MHz | — |
| Core Voltage | 1.5 V | — |
| Process Technology | 0.15 µm CMOS | — |
| Encapsulado | 724-BBGA, FCBGA | 724-pin FCBGA, 724-BBGA, or PBGA724 |
| Tipo de montaje | Surface Mount | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating-temperature range] |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | unknown |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL, HSTL, PCI, LVDS | — |
| Configuration Method | Serial or parallel (via Altera configuration devices) | — |
| Device Type | — | FPGA (Field Programmable Gate Array) |
| Family | — | APEX II |
| Gate Count | — | 3,000,000 gates |
| Logic Cells | — | 67,200 cells |
| I/O Count | — | 540 I/O |
| Configuration or Memory Capacity | — | [DATA_NEEDED: exact embedded-memory or configuration-memory capacity] |
| Tensión de alimentación | — | 1.5 V |
| Maximum Frequency | — | 420 MHz |
| Fabrication Process | — | 0.15 µm |
| Loadable PLD Timing | — | 2.17 ns |
| Technology | — | CMOS |
| Package Body Size | — | 35 mm x 35 mm |
| Package Pitch | — | 1.27 mm |
| Interface Capabilities | — | True-LVDS, LVPECL, PCML, and HyperTransport |
| REACH Status | — | unknown |
| AEC-Q100 Status | — | unknown |
| Lead-Free Status | — | unknown |