EP2A70B724C9ES vs EP2A70B724C7 Comparaison
Comparaison détaillée côte à côte de EP2A70B724C9ES par Intel et EP2A70B724C7 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP2A70B724C9ES - APEX II FPGA 3M Gates 67200 Cells 724-FCBGA | Intel
EP2A70B724C9ES ⚠ Dernier achatComparaison des spécifications
| Paramètre | EP2A70B724C9ES | EP2A70B724C7 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Dernier achat | Unknown |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 250,00 | $0,00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | APEX II | — |
| Logic Elements / Cells | 67200 | — |
| System Gates | 3,000,000 (3M) | — |
| Embedded Memory (bits) | 1,146,880 | — |
| Maximum User I/O | 540 | — |
| Operating Frequency (max) | 198 MHz | — |
| Core Voltage | 1.5 V | — |
| Process Technology | 0.15 µm CMOS | — |
| Boîtier | 724-BBGA, FCBGA | 724-pin FCBGA, 724-BBGA, or PBGA724 |
| Type de montage | Surface Mount | — |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating-temperature range] |
| Niveau MSL | [DATA_NEEDED: MSL level] | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | unknown |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL, HSTL, PCI, LVDS | — |
| Configuration Method | Serial or parallel (via Altera configuration devices) | — |
| Device Type | — | FPGA (Field Programmable Gate Array) |
| Family | — | APEX II |
| Gate Count | — | 3,000,000 gates |
| Logic Cells | — | 67,200 cells |
| I/O Count | — | 540 I/O |
| Configuration or Memory Capacity | — | [DATA_NEEDED: exact embedded-memory or configuration-memory capacity] |
| Tension d'alimentation | — | 1.5 V |
| Maximum Frequency | — | 420 MHz |
| Fabrication Process | — | 0.15 µm |
| Loadable PLD Timing | — | 2.17 ns |
| Technology | — | CMOS |
| Package Body Size | — | 35 mm x 35 mm |
| Package Pitch | — | 1.27 mm |
| Interface Capabilities | — | True-LVDS, LVPECL, PCML, and HyperTransport |
| REACH Status | — | unknown |
| AEC-Q100 Status | — | unknown |
| Lead-Free Status | — | unknown |