EP2A70F1508C6 vs EP2A70F1508C9 Comparación
Comparación detallada lado a lado de EP2A70F1508C6 por Altera y EP2A70F1508C9 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP2A70F1508C9 - APEX II FPGA 67.2K LE 1.5V 1508-FBGA | Intel / Altera
EP2A70F1508C9 ⚠ Última compraComparación de especificaciones
| Parámetro | EP2A70F1508C6 | EP2A70F1508C9 |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $175,00 | $1.310,00 |
| Family | APEX II | APEX II FPGA |
| Logic Elements | 18,460 | — |
| Number of LABs/CLBs | 1846 | — |
| Total RAM Bits | 1,669,248 | 1,146,880 |
| Maximum User I/O | 426 | — |
| Encapsulado | 1508-ball FineLine BGA | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Device Type | Field-Programmable Gate Array (FPGA) | — |
| Programmable Logic Type | SRAM-based, in-system reconfigurable | — |
| Configuration Interface | JTAG / Passive Serial | — |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL, HSTL | — |
| Operating Temperature Grade | Commercial (C suffix, 0C to +85C) | — |
| Speed Grade | 6 | C9 |
| Embedded Memory Type | Embedded System Blocks (ESBs) | Dual-port RAM (ESB) / ROM / FIFO |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Series | — | APEX II |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements / Cells | — | 67,200 |
| Number of I/O | — | 1,060 |
| Number of Logic Array Blocks (LABs) | — | [DATA_NEEDED: number of LABs] |
| Number of PLLs | — | 4 |
| Number of Gates | — | [DATA_NEEDED: typical gate count] |
| Voltage - Supply (Core) | — | 1.425 V to 1.575 V |
| Encapsulado / Carcasa | — | 1508-BBGA, FCBGA |
| Supplier Device Package | — | 1508-FBGA (40 × 40 mm) |
| Temperatura de funcionamiento | — | 0 °C to 85 °C |
| Process Technology | — | 0.15 µm all-layer copper, up to 8 metal layers |
| High-Speed I/O Standards | — | True-LVDS (1 Gbps), LVPECL, PCML, HyperTransport |
| Configuration Modes | — | Passive Serial, Passive Parallel Sync/Async, Fast Passive Parallel |
| Embedded Multiplier Blocks | — | Yes |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |