EP2A70F1508C6 vs EP2A70F1508C9 Comparaison
Comparaison détaillée côte à côte de EP2A70F1508C6 par Altera et EP2A70F1508C9 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP2A70F1508C9 - APEX II FPGA 67.2K LE 1.5V 1508-FBGA | Intel / Altera
EP2A70F1508C9 ⚠ Dernier achatComparaison des spécifications
| Paramètre | EP2A70F1508C6 | EP2A70F1508C9 |
|---|---|---|
| Marque | Altera | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $175,00 | $1 310,00 |
| Family | APEX II | APEX II FPGA |
| Logic Elements | 18,460 | — |
| Number of LABs/CLBs | 1846 | — |
| Total RAM Bits | 1,669,248 | 1,146,880 |
| Maximum User I/O | 426 | — |
| Boîtier | 1508-ball FineLine BGA | — |
| Type de montage | Surface Mount | Surface Mount |
| Device Type | Field-Programmable Gate Array (FPGA) | — |
| Programmable Logic Type | SRAM-based, in-system reconfigurable | — |
| Configuration Interface | JTAG / Passive Serial | — |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL, HSTL | — |
| Operating Temperature Grade | Commercial (C suffix, 0C to +85C) | — |
| Speed Grade | 6 | C9 |
| Embedded Memory Type | Embedded System Blocks (ESBs) | Dual-port RAM (ESB) / ROM / FIFO |
| Statut RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Series | — | APEX II |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements / Cells | — | 67,200 |
| Number of I/O | — | 1,060 |
| Number of Logic Array Blocks (LABs) | — | [DATA_NEEDED: number of LABs] |
| Number of PLLs | — | 4 |
| Number of Gates | — | [DATA_NEEDED: typical gate count] |
| Voltage - Supply (Core) | — | 1.425 V to 1.575 V |
| Boîtier / Format | — | 1508-BBGA, FCBGA |
| Supplier Device Package | — | 1508-FBGA (40 × 40 mm) |
| Température de fonctionnement | — | 0 °C to 85 °C |
| Process Technology | — | 0.15 µm all-layer copper, up to 8 metal layers |
| High-Speed I/O Standards | — | True-LVDS (1 Gbps), LVPECL, PCML, HyperTransport |
| Configuration Modes | — | Passive Serial, Passive Parallel Sync/Async, Fast Passive Parallel |
| Embedded Multiplier Blocks | — | Yes |
| Niveau MSL | — | [DATA_NEEDED: MSL level] |