EP2A70F1508C7N vs EP2A70F1508C9 Comparación
Comparación detallada lado a lado de EP2A70F1508C7N por Altera y EP2A70F1508C9 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP2A70F1508C9 - APEX II FPGA 67.2K LE 1.5V 1508-FBGA | Intel / Altera
EP2A70F1508C9 ⚠ Última compraComparación de especificaciones
| Parámetro | EP2A70F1508C7N | EP2A70F1508C9 |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $1.310,00 |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Series | APEX II | APEX II |
| Technology | 0.15 µm CMOS | — |
| Core Voltage | 1.5 V | — |
| Logic Cells | 67,200 cells | — |
| Logic Array Blocks | 6,720 LABs | — |
| Total RAM | 1,146,880 bits | — |
| Programmable I/O | 1,060 I/O pins | — |
| Maximum Stated Frequency | 420 MHz | — |
| Gate Capacity | 3 million gates | — |
| Encapsulado | 1508-pin FC-FBGA | — |
| Temperatura de funcionamiento | 0°C to 85°C | 0 °C to 85 °C |
| Tipo de montaje | Surface mount | Surface Mount |
| Estado RoHS | unknown | [DATA_NEEDED: RoHS status] |
| REACH Status | unknown | — |
| AEC-Q100 Qualification | unknown | — |
| Configuration Method | [DATA_NEEDED: configuration method] | — |
| Package Dimensions | [DATA_NEEDED: package dimensions] | — |
| Resistencia térmica | [DATA_NEEDED: thermal resistance] | — |
| Corriente de alimentación | [DATA_NEEDED: supply current] | — |
| Family | — | APEX II FPGA |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements / Cells | — | 67,200 |
| Total RAM Bits | — | 1,146,880 |
| Number of I/O | — | 1,060 |
| Number of Logic Array Blocks (LABs) | — | [DATA_NEEDED: number of LABs] |
| Number of PLLs | — | 4 |
| Number of Gates | — | [DATA_NEEDED: typical gate count] |
| Voltage - Supply (Core) | — | 1.425 V to 1.575 V |
| Encapsulado / Carcasa | — | 1508-BBGA, FCBGA |
| Supplier Device Package | — | 1508-FBGA (40 × 40 mm) |
| Speed Grade | — | C9 |
| Process Technology | — | 0.15 µm all-layer copper, up to 8 metal layers |
| High-Speed I/O Standards | — | True-LVDS (1 Gbps), LVPECL, PCML, HyperTransport |
| Configuration Modes | — | Passive Serial, Passive Parallel Sync/Async, Fast Passive Parallel |
| Embedded Multiplier Blocks | — | Yes |
| Embedded Memory Type | — | Dual-port RAM (ESB) / ROM / FIFO |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |