EP2A70F1508C7N vs EP2A70F1508C9 Comparaison
Comparaison détaillée côte à côte de EP2A70F1508C7N par Altera et EP2A70F1508C9 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP2A70F1508C9 - APEX II FPGA 67.2K LE 1.5V 1508-FBGA | Intel / Altera
EP2A70F1508C9 ⚠ Dernier achatComparaison des spécifications
| Paramètre | EP2A70F1508C7N | EP2A70F1508C9 |
|---|---|---|
| Marque | Altera | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $1 310,00 |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Series | APEX II | APEX II |
| Technology | 0.15 µm CMOS | — |
| Core Voltage | 1.5 V | — |
| Logic Cells | 67,200 cells | — |
| Logic Array Blocks | 6,720 LABs | — |
| Total RAM | 1,146,880 bits | — |
| Programmable I/O | 1,060 I/O pins | — |
| Maximum Stated Frequency | 420 MHz | — |
| Gate Capacity | 3 million gates | — |
| Boîtier | 1508-pin FC-FBGA | — |
| Température de fonctionnement | 0°C to 85°C | 0 °C to 85 °C |
| Type de montage | Surface mount | Surface Mount |
| Statut RoHS | unknown | [DATA_NEEDED: RoHS status] |
| REACH Status | unknown | — |
| AEC-Q100 Qualification | unknown | — |
| Configuration Method | [DATA_NEEDED: configuration method] | — |
| Package Dimensions | [DATA_NEEDED: package dimensions] | — |
| Résistance thermique | [DATA_NEEDED: thermal resistance] | — |
| Courant d'alimentation | [DATA_NEEDED: supply current] | — |
| Family | — | APEX II FPGA |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements / Cells | — | 67,200 |
| Total RAM Bits | — | 1,146,880 |
| Number of I/O | — | 1,060 |
| Number of Logic Array Blocks (LABs) | — | [DATA_NEEDED: number of LABs] |
| Number of PLLs | — | 4 |
| Number of Gates | — | [DATA_NEEDED: typical gate count] |
| Voltage - Supply (Core) | — | 1.425 V to 1.575 V |
| Boîtier / Format | — | 1508-BBGA, FCBGA |
| Supplier Device Package | — | 1508-FBGA (40 × 40 mm) |
| Speed Grade | — | C9 |
| Process Technology | — | 0.15 µm all-layer copper, up to 8 metal layers |
| High-Speed I/O Standards | — | True-LVDS (1 Gbps), LVPECL, PCML, HyperTransport |
| Configuration Modes | — | Passive Serial, Passive Parallel Sync/Async, Fast Passive Parallel |
| Embedded Multiplier Blocks | — | Yes |
| Embedded Memory Type | — | Dual-port RAM (ESB) / ROM / FIFO |
| Niveau MSL | — | [DATA_NEEDED: MSL level] |