EP2A70F1508C9 vs EP2A70F1508C8ES Comparación
Comparación detallada lado a lado de EP2A70F1508C9 por Intel y EP2A70F1508C8ES por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP2A70F1508C9 - APEX II FPGA 67.2K LE 1.5V 1508-FBGA | Intel / Altera
EP2A70F1508C9 ⚠ Última compraComparación de especificaciones
| Parámetro | EP2A70F1508C9 | EP2A70F1508C8ES |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.310,00 | $0,00 |
| Series | APEX II | EP2A |
| Family | APEX II FPGA | APEX II |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements / Cells | 67,200 | — |
| Total RAM Bits | 1,146,880 | — |
| Number of I/O | 1,060 | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: number of LABs] | — |
| Number of PLLs | 4 | — |
| Number of Gates | [DATA_NEEDED: typical gate count] | — |
| Voltage - Supply (Core) | 1.425 V to 1.575 V | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Encapsulado / Carcasa | 1508-BBGA, FCBGA | — |
| Supplier Device Package | 1508-FBGA (40 × 40 mm) | — |
| Temperatura de funcionamiento | 0 °C to 85 °C | Commercial (0C to +85C) |
| Speed Grade | C9 | -8 |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | — |
| High-Speed I/O Standards | True-LVDS (1 Gbps), LVPECL, PCML, HyperTransport | — |
| Configuration Modes | Passive Serial, Passive Parallel Sync/Async, Fast Passive Parallel | — |
| Embedded Multiplier Blocks | Yes | — |
| Embedded Memory Type | Dual-port RAM (ESB) / ROM / FIFO | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Check manufacturer page - APEX II is a mature family with mixed compliance |
| Nivel MSL | [DATA_NEEDED: MSL level] | 3 |
| System Gates | — | 1,146,880 |
| Logic Elements | — | 67,200 |
| Embedded System Blocks (ESB) | — | Available (dual-port RAM/ROM/FIFO/CAM) |
| Maximum User I/O | — | 1,060 |
| Number of I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Core Voltage | — | 1.5 V |
| Encapsulado | — | 1508-ball FCBGA (Fine-pitch Chip-Scale BGA) |
| Configuration Memory | — | SRAM (in-system programmable) |