EP2A70F1508C9 vs EP2A70F1508C8ES Comparaison
Comparaison détaillée côte à côte de EP2A70F1508C9 par Intel et EP2A70F1508C8ES par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP2A70F1508C9 - APEX II FPGA 67.2K LE 1.5V 1508-FBGA | Intel / Altera
EP2A70F1508C9 ⚠ Dernier achatComparaison des spécifications
| Paramètre | EP2A70F1508C9 | EP2A70F1508C8ES |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Dernier achat | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 310,00 | $0,00 |
| Series | APEX II | EP2A |
| Family | APEX II FPGA | APEX II |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements / Cells | 67,200 | — |
| Total RAM Bits | 1,146,880 | — |
| Number of I/O | 1,060 | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: number of LABs] | — |
| Number of PLLs | 4 | — |
| Number of Gates | [DATA_NEEDED: typical gate count] | — |
| Voltage - Supply (Core) | 1.425 V to 1.575 V | — |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Boîtier / Format | 1508-BBGA, FCBGA | — |
| Supplier Device Package | 1508-FBGA (40 × 40 mm) | — |
| Température de fonctionnement | 0 °C to 85 °C | Commercial (0C to +85C) |
| Speed Grade | C9 | -8 |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | — |
| High-Speed I/O Standards | True-LVDS (1 Gbps), LVPECL, PCML, HyperTransport | — |
| Configuration Modes | Passive Serial, Passive Parallel Sync/Async, Fast Passive Parallel | — |
| Embedded Multiplier Blocks | Yes | — |
| Embedded Memory Type | Dual-port RAM (ESB) / ROM / FIFO | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | Check manufacturer page - APEX II is a mature family with mixed compliance |
| Niveau MSL | [DATA_NEEDED: MSL level] | 3 |
| System Gates | — | 1,146,880 |
| Logic Elements | — | 67,200 |
| Embedded System Blocks (ESB) | — | Available (dual-port RAM/ROM/FIFO/CAM) |
| Maximum User I/O | — | 1,060 |
| Number of I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Core Voltage | — | 1.5 V |
| Boîtier | — | 1508-ball FCBGA (Fine-pitch Chip-Scale BGA) |
| Configuration Memory | — | SRAM (in-system programmable) |