EP2AGX190FF35C4G vs EP2AGX190FF35I3G Comparación

Comparación detallada lado a lado de EP2AGX190FF35C4G por Altera y EP2AGX190FF35I3G por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Altera
EP2AGX190FF35I3G EP2AGX190FF35I3G - Arria II GX FPGA 190K LE | Intel | Altera

EP2AGX190FF35I3G - Arria II GX FPGA 190K LE | Intel | Altera

EP2AGX190FF35I3G ⚠ Última compra

Comparación de especificaciones

Parámetro EP2AGX190FF35C4G EP2AGX190FF35I3G
Marca Altera Altera
Categoría FPGA & CPLD FPGA & CPLD
Estado del ciclo de vida Activo Última compra
Estado del stock In Stock In Stock
Precio unitario (USD) $2.350,00 $1.840,00
Family Arria II GX Arria II GX
Logic Elements 181,165 —
Equivalent Logic Elements 190,000 —
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Embedded Memory (bits) 10,177,536 10,177,536
Embedded Memory (M20K blocks) [DATA_NEEDED: M20K block count] —
Embedded 18x18 Multipliers 612 —
Transceiver Channels 12 (up to 6.375 Gbps) —
Maximum Transceiver Data Rate 6.375 Gbps —
Hard PCIe Gen2 Blocks Yes (2) —
User I/O Pins (maximum) [DATA_NEEDED: user I/O count] —
Encapsulado 1152-BBGA, FCBGA (35 mm) 1152-ball FC-FBGA (FF35), 35 mm body
Process Technology 40 nm low-power CMOS —
Operating Temperature Grade Commercial (0C to +85C) —
Speed Grade C4 3
Tipo de montaje Surface Mount (BGA) Surface Mount (flip-chip BGA)
Nivel MSL 3 (per JEDEC J-STD-020) —
Estado RoHS Compliant Compliant (suffix G)
Lead-Free Yes Yes
Development Tool Quartus II (legacy) —
Logic Elements (LE) — 181,165
Adaptive Logic Modules (ALM) — [DATA_NEEDED: ALM count]
User I/O Pins — 612
Number of I/O Banks — [DATA_NEEDED: number of I/O banks]
Transceivers — 8 high-speed transceiver channels (multi-gigabit)
Embedded Multipliers — [DATA_NEEDED: 18x18 multiplier count]
PLLs — [DATA_NEEDED: PLL count]
Core Voltage — 0.9 V
I/O Voltage Standards — 1.2 V to 3.3 V (LVTTL, LVCMOS, LVDS, HSTL, SSTL)
Process Node — 40 nm
Temperatura de funcionamiento — -40 °C to +100 °C (industrial, suffix I)
Ball Pitch — [DATA_NEEDED: 1.0 mm (typical for FF35)]
Programming Toolchain — Quartus II / Quartus Prime

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