EP2AGX260EF29I5N vs EP2AGX260EF29C4 Comparación
Comparación detallada lado a lado de EP2AGX260EF29I5N por Intel y EP2AGX260EF29C4 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX260EF29I5N | EP2AGX260EF29C4 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.950,00 | $339,50 |
| Series | Arria II GX | Arria II GX |
| Family | Arria II | — |
| Logic Elements | 244,188 | 244,188 |
| Adaptive Logic Modules (ALMs) | 10260 LABs | — |
| Embedded Memory Bits | 12,038,144 bits | 12,038,144 |
| Maximum User I/O | 372 | — |
| Number of I/O | 372 | — |
| Number of Transceivers | 12 | — |
| Transceiver Data Rate (CPLL) | up to 3.75 Gbps | — |
| Transceiver Data Rate (Channel PLL) | up to 5 Gbps | — |
| 18x18 Multipliers | 1,152 | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Speed Grade | 5 | -4 (commercial) |
| Package Type | 780-BBGA, FCBGA (Flip-Chip BGA) | — |
| Package Dimensions | 29 mm x 29 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Lead Free | Yes | — |
| Estado RoHS | Compliant | — |
| Process Technology | CMOS | 40 nm CMOS |
| Configuration | JTAG / passive serial / fast passive parallel | — |
| Logic Array Blocks (LABs) | — | 10,260 |
| Embedded 18x18 Multipliers | — | 1,008 |
| PLLs | — | 8 |
| User I/O Pins | — | 372 |
| Transceivers | — | Up to 12 |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| Core Voltage | — | 0.9 V |
| Encapsulado | — | 780-ball FC-FBGA (FBGA-780) |
| Temperatura de funcionamiento | — | 0C to +85C (commercial) |