EP2AGX260EF29I5N vs EP2AGX260EF29I3G Comparación
Comparación detallada lado a lado de EP2AGX260EF29I5N por Intel y EP2AGX260EF29I3G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX260EF29I5N | EP2AGX260EF29I3G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.950,00 | $1.480,00 |
| Series | Arria II GX | Arria II GX |
| Family | Arria II | Arria II GX |
| Logic Elements | 244,188 | — |
| Adaptive Logic Modules (ALMs) | 10260 LABs | — |
| Embedded Memory Bits | 12,038,144 bits | — |
| Maximum User I/O | 372 | — |
| Number of I/O | 372 | 372 |
| Number of Transceivers | 12 | — |
| Transceiver Data Rate (CPLL) | up to 3.75 Gbps | — |
| Transceiver Data Rate (Channel PLL) | up to 5 Gbps | — |
| 18x18 Multipliers | 1,152 | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Speed Grade | 5 | — |
| Package Type | 780-BBGA, FCBGA (Flip-Chip BGA) | — |
| Package Dimensions | 29 mm x 29 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Lead Free | Yes | [DATA_NEEDED: lead-free status] |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Process Technology | CMOS | 40 nm |
| Configuration | JTAG / passive serial / fast passive parallel | — |
| Logic Elements / Cells | — | 244,188 |
| Total RAM Bits | — | 12,038,144 |
| Number of Logic Blocks | — | [DATA_NEEDED: logic blocks count] |
| Number of Gates | — | [DATA_NEEDED: gate count] |
| Core Voltage | — | 0.9 V |
| Operating Frequency (max) | — | 500 MHz |
| Temperatura de funcionamiento | — | -40C to +100C (Industrial) |
| Encapsulado / Carcasa | — | 780-BBGA, FCBGA |