EP2AGX260EF29I5N vs EP2AGX260EF29I3G Comparaison
Comparaison détaillée côte à côte de EP2AGX260EF29I5N par Intel et EP2AGX260EF29I3G par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2AGX260EF29I5N | EP2AGX260EF29I3G |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 950,00 | $1 480,00 |
| Series | Arria II GX | Arria II GX |
| Family | Arria II | Arria II GX |
| Logic Elements | 244,188 | — |
| Adaptive Logic Modules (ALMs) | 10260 LABs | — |
| Embedded Memory Bits | 12,038,144 bits | — |
| Maximum User I/O | 372 | — |
| Number of I/O | 372 | 372 |
| Number of Transceivers | 12 | — |
| Transceiver Data Rate (CPLL) | up to 3.75 Gbps | — |
| Transceiver Data Rate (Channel PLL) | up to 5 Gbps | — |
| 18x18 Multipliers | 1,152 | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Speed Grade | 5 | — |
| Package Type | 780-BBGA, FCBGA (Flip-Chip BGA) | — |
| Package Dimensions | 29 mm x 29 mm | — |
| Type de montage | Surface Mount | Surface Mount |
| Niveau MSL | [DATA_NEEDED: MSL level] | — |
| Lead Free | Yes | [DATA_NEEDED: lead-free status] |
| Statut RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Process Technology | CMOS | 40 nm |
| Configuration | JTAG / passive serial / fast passive parallel | — |
| Logic Elements / Cells | — | 244,188 |
| Total RAM Bits | — | 12,038,144 |
| Number of Logic Blocks | — | [DATA_NEEDED: logic blocks count] |
| Number of Gates | — | [DATA_NEEDED: gate count] |
| Core Voltage | — | 0.9 V |
| Operating Frequency (max) | — | 500 MHz |
| Température de fonctionnement | — | -40C to +100C (Industrial) |
| Boîtier / Format | — | 780-BBGA, FCBGA |