EP2AGX45DF25C5N vs EP2AGX45DF25I5N Comparación
Comparación detallada lado a lado de EP2AGX45DF25C5N por Intel y EP2AGX45DF25I5N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX45DF25C5N | EP2AGX45DF25I5N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $258,20 | $215,75 |
| Family | Arria II GX | Arria II GX |
| Series | Arria II GX | — |
| Number of Logic Elements (LEs) | 42,959 | — |
| Number of LABs/CLBs | 1,805 | — |
| Total RAM Bits | 3,517,440 | — |
| Number of User I/O | 252 | — |
| Number of Transceivers | 4 or 8 (device-dependent) | — |
| Transceiver Data Rate | Up to 3.125 Gbps | — |
| Process Technology | 40 nm CMOS | — |
| Core Supply Voltage | 0.9 V | — |
| Maximum Internal Frequency | 500 MHz | — |
| Speed Grade | C5 (commercial, -20 °C to +85 °C) | I5 (industrial, mid-speed) |
| Encapsulado | 572-ball FC-FBGA (Flip-Chip BGA), 25 × 25 mm | 572-ball FCBGA, 25 mm x 25 mm |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Lead-Free / RoHS | Lead Free (MSL per JEDEC J-STD-020) | — |
| PCI Express Hard IP | Yes, PCIe Gen1 ×1/×4 | — |
| Configuration Modes | JTAG, AS, PS, FPP | — |
| Logic Elements | — | 42,959 |
| Adaptive Logic Modules | — | 17,015 |
| LABs | — | 1,805 |
| Embedded Memory | — | 3,517,440 bits |
| User I/Os | — | 252 |
| Transceivers | — | 8 channels at up to 3.75 Gbps |
| PCIe Hard IP | — | 4 blocks, Gen1 x4 / Gen2 x4 |
| Process Node | — | 40 nm |
| Core Voltage | — | 0.9 V |
| Temperatura de funcionamiento | — | -40C to +100C (Industrial) |
| Nivel MSL | — | 3 (168 hours) |
| Estado RoHS | — | Compliant |