EP2AGX45DF29C4N vs EP2AGX45DF29C5G Comparación
Comparación detallada lado a lado de EP2AGX45DF29C4N por Intel y EP2AGX45DF29C5G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX45DF29C4N | EP2AGX45DF29C5G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $335,45 | $335,00 |
| Series | Arria II GX | — |
| Device Family | Arria II GX FPGA | — |
| Logic Elements (LE) | 42,959 | 42,959 |
| Number of LABs | 1805 | — |
| Embedded Memory (Bits) | 3,517,440 | — |
| M9K Memory Blocks | 1541 Kbits | — |
| MLAB Memory | 656 Kbits (configurable as LEs) | — |
| DSP Blocks (18x18 Multipliers) | 232 | — |
| Number of Transceivers | 8 channels | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Maximum User I/O | 364 | — |
| PLL Count | 8 (4 enhanced + 4 fast) | — |
| Global Clock Networks | Up to 16 | — |
| Process Technology | 40 nm TSMC | — |
| Core Voltage (VCC) | 1.1 V | — |
| Auxiliary Supply (VCCPT) | 0.9 V | — |
| Speed Grade | C4 (commercial, mid-speed) | C5 |
| Temperature Range | 0C to +85C (commercial) | — |
| Encapsulado | 780-ball FBGA (FineLine BGA, 29x29 mm) | 780-ball FC-FBGA (29 mm x 29 mm) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Nivel MSL | 3 | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Family | — | Arria II GX |
| Logic Array Blocks (LABs) | — | 1,805 |
| Embedded Memory Bits | — | 3,517,440 |
| User I/O Count | — | 364 |
| Transceiver Channels | — | 8 |
| Max Transceiver Data Rate | — | 6.375 Gbps |
| Core Voltage (typ.) | — | 0.9 V |
| Temperatura de unión de funcionamiento | — | 0°C to 85°C (Commercial) |
| Lead Finish | — | Pb-free (G suffix) |
| Configuration Memory | — | SRAM-based (volatile) |
| Process Node | — | 40 nm TSMC low-power |
| Hard Memory Controllers | — | DDR3 / DDR2 / QDR II+ / QDR II |
| PCI Express Hard IP | — | Gen1/Gen2 (PIPE) |
| DSP 18x18 Multipliers | — | Up to 156 |
| PLLs | — | On-die (multiple) |