EP2AGX45DF29C4N vs EP2AGX45DF29C5G Comparaison
Comparaison détaillée côte à côte de EP2AGX45DF29C4N par Intel et EP2AGX45DF29C5G par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2AGX45DF29C4N | EP2AGX45DF29C5G |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $335,45 | $335,00 |
| Series | Arria II GX | — |
| Device Family | Arria II GX FPGA | — |
| Logic Elements (LE) | 42,959 | 42,959 |
| Number of LABs | 1805 | — |
| Embedded Memory (Bits) | 3,517,440 | — |
| M9K Memory Blocks | 1541 Kbits | — |
| MLAB Memory | 656 Kbits (configurable as LEs) | — |
| DSP Blocks (18x18 Multipliers) | 232 | — |
| Number of Transceivers | 8 channels | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Maximum User I/O | 364 | — |
| PLL Count | 8 (4 enhanced + 4 fast) | — |
| Global Clock Networks | Up to 16 | — |
| Process Technology | 40 nm TSMC | — |
| Core Voltage (VCC) | 1.1 V | — |
| Auxiliary Supply (VCCPT) | 0.9 V | — |
| Speed Grade | C4 (commercial, mid-speed) | C5 |
| Temperature Range | 0C to +85C (commercial) | — |
| Boîtier | 780-ball FBGA (FineLine BGA, 29x29 mm) | 780-ball FC-FBGA (29 mm x 29 mm) |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Niveau MSL | 3 | — |
| Statut RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Family | — | Arria II GX |
| Logic Array Blocks (LABs) | — | 1,805 |
| Embedded Memory Bits | — | 3,517,440 |
| User I/O Count | — | 364 |
| Transceiver Channels | — | 8 |
| Max Transceiver Data Rate | — | 6.375 Gbps |
| Core Voltage (typ.) | — | 0.9 V |
| Température de jonction en fonctionnement | — | 0°C to 85°C (Commercial) |
| Lead Finish | — | Pb-free (G suffix) |
| Configuration Memory | — | SRAM-based (volatile) |
| Process Node | — | 40 nm TSMC low-power |
| Hard Memory Controllers | — | DDR3 / DDR2 / QDR II+ / QDR II |
| PCI Express Hard IP | — | Gen1/Gen2 (PIPE) |
| DSP 18x18 Multipliers | — | Up to 156 |
| PLLs | — | On-die (multiple) |