EP2AGX45DF29I3NAD vs EP2AGX45DF29I3N Comparación
Comparación detallada lado a lado de EP2AGX45DF29I3NAD por Intel y EP2AGX45DF29I3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX45DF29I3NAD | EP2AGX45DF29I3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $285,10 | $215,00 |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 42,959 | — |
| Logic Array Blocks (LABs) | 1,805 | — |
| Embedded RAM Bits | 3,517,440 | — |
| User I/Os | 364 | — |
| Encapsulado | 780-ball FBGA (FineLine BGA) | 780-ball FC-FBGA (DF29) |
| Process Node | 40 nm | — |
| Transceivers | Multi-gigabit transceivers integrated | Up to 8 channels, 3.125 Gbps |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps | — |
| Multipliers (18x18) | 156 (typical) | — |
| Speed Grade | I3 (industrial, -40C to +100C junction, fastest speed bin in the I grade) | I3 |
| Temperature Grade | Industrial (I) | — |
| Estado RoHS | [DATA_NEEDED: rohs status] | Compliant |
| Tipo de montaje | Surface Mount | Surface Mount (flip-chip BGA) |
| Core Voltage | [DATA_NEEDED: VCCINT typical value] | 0.9 V |
| Series | — | EP2AGX45 |
| Number of Logic Elements | — | 42,959 |
| Number of LABs/CLBs | — | 1,805 |
| Total RAM Bits | — | 3,517,440 |
| Number of User I/O | — | 364 |
| Temperatura de funcionamiento | — | -40 C to +100 C (industrial) |
| Process Technology | — | 40 nm |
| Hard PCIe Controller | — | PCIe Gen1/Gen2 x1/x4 |
| Maximum User I/O Frequency | — | 500 MHz Fmax |
| Embedded Multipliers | — | [DATA_NEEDED: 18x18 multiplier count] |
| External Memory Support | — | DDR2, DDR3, QDRII+, RLDRAM II |