EP2AGX45DF29I5 vs EP2AGX45DF29I3N Comparación
Comparación detallada lado a lado de EP2AGX45DF29I5 por Intel y EP2AGX45DF29I3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX45DF29I5 | EP2AGX45DF29I3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $285,00 | $215,00 |
| Family | Arria II GX | Arria II GX |
| Device Logic Elements | 42,959 | — |
| Logic Array Blocks (LABs) | 1,805 | — |
| User I/Os | 364 | — |
| Embedded Memory (bits) | 3,517,440 | — |
| 18x18 Multipliers | 564 | — |
| Transceivers | 8 full-duplex channels | Up to 8 channels, 3.125 Gbps |
| Transceiver Data Rate (max) | 3.75 Gbps | — |
| Hard PCIe Gen2 IP Block | 1 x PCIe Gen2 x4 | — |
| Process Node | 40 nm (TSMC) | — |
| Core Supply Voltage | 0.9 V | — |
| Temperatura de funcionamiento | -40C to +100C (industrial, I5 speed grade) | -40 C to +100 C (industrial) |
| Encapsulado | 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch) | 780-ball FC-FBGA (DF29) |
| Tipo de montaje | Surface Mount | Surface Mount (flip-chip BGA) |
| Estado RoHS | Compliant | Compliant |
| Series | — | EP2AGX45 |
| Number of Logic Elements | — | 42,959 |
| Number of LABs/CLBs | — | 1,805 |
| Total RAM Bits | — | 3,517,440 |
| Number of User I/O | — | 364 |
| Speed Grade | — | I3 |
| Process Technology | — | 40 nm |
| Core Voltage | — | 0.9 V |
| Hard PCIe Controller | — | PCIe Gen1/Gen2 x1/x4 |
| Maximum User I/O Frequency | — | 500 MHz Fmax |
| Embedded Multipliers | — | [DATA_NEEDED: 18x18 multiplier count] |
| External Memory Support | — | DDR2, DDR3, QDRII+, RLDRAM II |