EP2AGX45DF29I5N vs EP2AGX45DF29I6N Comparación
Comparación detallada lado a lado de EP2AGX45DF29I5N por Intel y EP2AGX45DF29I6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX45DF29I5N | EP2AGX45DF29I6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $318,00 | $185,00 |
| Device Family | Arria II GX | Arria II GX |
| Logic Elements | 42,959 | 42,960 |
| Logic Array Blocks (LABs) | 1,805 | — |
| Embedded Memory (M9K blocks) | 3,517,440 bits | — |
| User I/Os | 364 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Transceivers | [DATA_NEEDED: number of transceiver channels] | — |
| Max Transceiver Data Rate | 3.75 Gbps | — |
| PLLs | 4 | — |
| Process Technology | 40 nm | — |
| Core Supply Voltage | 0.9 V | — |
| Temperatura de funcionamiento | -40C to +100C (industrial) | — |
| Package Type | 780-ball FC-FBGA | — |
| Package Dimensions | 29 mm x 29 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Nivel MSL | 3 | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Device Sub-family | — | EP2AGX45 |
| Embedded Memory | — | 1,728 Kbits (M9K + M144K) |
| User I/O Pins | — | 364 |
| Transceiver Channels | — | 8 (up to 6.375 Gbps) |
| Hard PCIe IP | — | PCIe Gen1/Gen2 x1/x4 endpoints |
| Hard Memory Controller | — | DDR3 (with soft PHY) |
| Encapsulado | — | 780-ball FCBGA (FineLine BGA, DF29 pin-out) |
| Speed Grade | — | 6 (fastest transceiver bin) |
| Temperature Grade | — | Industrial (-40C to +100C) |
| Process Node | — | 40 nm TSMC |
| Logic Element Structure | — | 8-input ALM (Adaptive Logic Module) |