EP2AGX45DF29I5N vs EP2AGX45DF29I6N Comparaison
Comparaison détaillée côte à côte de EP2AGX45DF29I5N par Intel et EP2AGX45DF29I6N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2AGX45DF29I5N | EP2AGX45DF29I6N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $318,00 | $185,00 |
| Device Family | Arria II GX | Arria II GX |
| Logic Elements | 42,959 | 42,960 |
| Logic Array Blocks (LABs) | 1,805 | — |
| Embedded Memory (M9K blocks) | 3,517,440 bits | — |
| User I/Os | 364 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Transceivers | [DATA_NEEDED: number of transceiver channels] | — |
| Max Transceiver Data Rate | 3.75 Gbps | — |
| PLLs | 4 | — |
| Process Technology | 40 nm | — |
| Core Supply Voltage | 0.9 V | — |
| Température de fonctionnement | -40C to +100C (industrial) | — |
| Package Type | 780-ball FC-FBGA | — |
| Package Dimensions | 29 mm x 29 mm | — |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Niveau MSL | 3 | — |
| Statut RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Device Sub-family | — | EP2AGX45 |
| Embedded Memory | — | 1,728 Kbits (M9K + M144K) |
| User I/O Pins | — | 364 |
| Transceiver Channels | — | 8 (up to 6.375 Gbps) |
| Hard PCIe IP | — | PCIe Gen1/Gen2 x1/x4 endpoints |
| Hard Memory Controller | — | DDR3 (with soft PHY) |
| Boîtier | — | 780-ball FCBGA (FineLine BGA, DF29 pin-out) |
| Speed Grade | — | 6 (fastest transceiver bin) |
| Temperature Grade | — | Industrial (-40C to +100C) |
| Process Node | — | 40 nm TSMC |
| Logic Element Structure | — | 8-input ALM (Adaptive Logic Module) |