EP2AGX65DF29C6 vs EP2AGX65DF29C3N Comparación
Comparación detallada lado a lado de EP2AGX65DF29C6 por Intel y EP2AGX65DF29C3N por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX65DF29C6 | EP2AGX65DF29C3N |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Unknown |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $440,00 | $0,00 |
| Family | Arria II GX | — |
| Logic Elements (LE) | 60,214 | — |
| Logic Array Blocks (LABs) | 2,530 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (bits) | 5,371,904 | — |
| Maximum User I/O | 364 | — |
| DSP Blocks (18x18 Multipliers) | [DATA_NEEDED: DSP block count] | — |
| Transceivers | 8 (up to 3.75 Gbps per Arria II GX family spec) | — |
| PLLs | 4 | — |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm | — |
| Speed Grade | 6 (C6) | — |
| Temperatura de funcionamiento | Commercial (0C to +85C) | [DATA_NEEDED: operating temperature range] |
| Encapsulado | 780-ball FC-FBGA (29x29 mm) | FBGA-572 |
| Tipo de montaje | Surface Mount (flip-chip BGA) | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Product Family | — | Arria II GX |
| Logic Elements | — | 60,214 |
| Embedded Memory | — | 602,214 bit |
| User I/O Pins | — | 364 |
| Package Designation | — | DF29 |
| Total Pins or Balls | — | 572 |
| Tensión de alimentación | — | 0.9 V |
| Technology | — | 65 nm |
| Transceiver Count | — | [DATA_NEEDED: integrated transceiver count] |
| Maximum I/O Frequency | — | [DATA_NEEDED: maximum I/O operating frequency] |