EP2AGX65DF29C6 vs EP2AGX65DF29C3N Comparaison
Comparaison détaillée côte à côte de EP2AGX65DF29C6 par Intel et EP2AGX65DF29C3N par Altera. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2AGX65DF29C6 | EP2AGX65DF29C3N |
|---|---|---|
| Marque | Intel | Altera |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Unknown |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $440,00 | $0,00 |
| Family | Arria II GX | — |
| Logic Elements (LE) | 60,214 | — |
| Logic Array Blocks (LABs) | 2,530 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (bits) | 5,371,904 | — |
| Maximum User I/O | 364 | — |
| DSP Blocks (18x18 Multipliers) | [DATA_NEEDED: DSP block count] | — |
| Transceivers | 8 (up to 3.75 Gbps per Arria II GX family spec) | — |
| PLLs | 4 | — |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm | — |
| Speed Grade | 6 (C6) | — |
| Température de fonctionnement | Commercial (0C to +85C) | [DATA_NEEDED: operating temperature range] |
| Boîtier | 780-ball FC-FBGA (29x29 mm) | FBGA-572 |
| Type de montage | Surface Mount (flip-chip BGA) | Surface Mount |
| Niveau MSL | [DATA_NEEDED: MSL level] | — |
| Statut RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Product Family | — | Arria II GX |
| Logic Elements | — | 60,214 |
| Embedded Memory | — | 602,214 bit |
| User I/O Pins | — | 364 |
| Package Designation | — | DF29 |
| Total Pins or Balls | — | 572 |
| Tension d'alimentation | — | 0.9 V |
| Technology | — | 65 nm |
| Transceiver Count | — | [DATA_NEEDED: integrated transceiver count] |
| Maximum I/O Frequency | — | [DATA_NEEDED: maximum I/O operating frequency] |