EP2AGZ225FF35C4G vs EP2AGZ300FF35C4N Comparación
Comparación detallada lado a lado de EP2AGZ225FF35C4G por Intel y EP2AGZ300FF35C4N por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ225FF35C4G | EP2AGZ300FF35C4N |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $1.350,00 |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Manufacturer | Intel | — |
| Product Family | FPGA | — |
| User I/O | 554 I/O | — |
| Encapsulado | 1152FBGA | — |
| Package Type | Fine-pitch ball grid array | 1152-BBGA, FCBGA (flip-chip) |
| Logic Elements | [DATA_NEEDED: logic element count] | 298,000 |
| Embedded Memory | [DATA_NEEDED: embedded memory capacity] | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: number of DSP blocks] |
| Transceivers | [DATA_NEEDED: transceiver count] | Multi-gigabit transceivers integrated |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| Tensión de alimentación | [DATA_NEEDED: supply voltage] | — |
| I/O Standards | [DATA_NEEDED: supported I/O standards] | — |
| Configuration Method | [DATA_NEEDED: configuration method] | — |
| Estado RoHS | unknown | Compliant (per Besenchips / DigiKey listing) |
| REACH Status | unknown | — |
| AEC-Q100 Qualification | not_applicable | — |
| Lead-Free Status | unknown | Lead free (per Besenchips listing) |
| Halogen-Free Status | unknown | — |
| Series | — | Arria II GZ |
| Logic Array Blocks (LABs) | — | 11,920 |
| Embedded Memory (bits) | — | 18,854,912 (~17.9 Mbit) |
| User I/O Count | — | 554 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Process Technology | — | 40 nm |
| Core Voltage | — | 0.9 V |
| Terminal Form | — | Ball |
| Package Code (JEDEC) | — | HBGA |
| Operating Temperature Grade | — | Commercial (C4 = 0C to +85C) |
| Configuration Memory | — | SRAM-based (volatile, requires boot device) |
| PLLs | — | [DATA_NEEDED: PLL count] |
| Tipo de montaje | — | Surface Mount |
| Maximum Operating Frequency | — | 500 MHz |