EP2AGZ225FF35C4G vs EP2AGZ300FF35C4N Comparaison
Comparaison détaillée côte à côte de EP2AGZ225FF35C4G par Intel et EP2AGZ300FF35C4N par Altera. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2AGZ225FF35C4G | EP2AGZ300FF35C4N |
|---|---|---|
| Marque | Intel | Altera |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $1 350,00 |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Manufacturer | Intel | — |
| Product Family | FPGA | — |
| User I/O | 554 I/O | — |
| Boîtier | 1152FBGA | — |
| Package Type | Fine-pitch ball grid array | 1152-BBGA, FCBGA (flip-chip) |
| Logic Elements | [DATA_NEEDED: logic element count] | 298,000 |
| Embedded Memory | [DATA_NEEDED: embedded memory capacity] | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: number of DSP blocks] |
| Transceivers | [DATA_NEEDED: transceiver count] | Multi-gigabit transceivers integrated |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | — |
| Tension d'alimentation | [DATA_NEEDED: supply voltage] | — |
| I/O Standards | [DATA_NEEDED: supported I/O standards] | — |
| Configuration Method | [DATA_NEEDED: configuration method] | — |
| Statut RoHS | unknown | Compliant (per Besenchips / DigiKey listing) |
| REACH Status | unknown | — |
| AEC-Q100 Qualification | not_applicable | — |
| Lead-Free Status | unknown | Lead free (per Besenchips listing) |
| Halogen-Free Status | unknown | — |
| Series | — | Arria II GZ |
| Logic Array Blocks (LABs) | — | 11,920 |
| Embedded Memory (bits) | — | 18,854,912 (~17.9 Mbit) |
| User I/O Count | — | 554 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Process Technology | — | 40 nm |
| Core Voltage | — | 0.9 V |
| Terminal Form | — | Ball |
| Package Code (JEDEC) | — | HBGA |
| Operating Temperature Grade | — | Commercial (C4 = 0C to +85C) |
| Configuration Memory | — | SRAM-based (volatile, requires boot device) |
| PLLs | — | [DATA_NEEDED: PLL count] |
| Type de montage | — | Surface Mount |
| Maximum Operating Frequency | — | 500 MHz |